Patents by Inventor Tetsujiro Tada

Tetsujiro Tada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8814635
    Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: August 26, 2014
    Assignees: Sanshin Co., Ltd., Nihon Micro Coating Co., Ltd.
    Inventors: Nobukazu Hosokai, Isamu Oguro, Jun Watanabe, Tetsujiro Tada
  • Publication number: 20120045968
    Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
    Type: Application
    Filed: January 27, 2011
    Publication date: February 23, 2012
    Applicants: NIHON MICRO COATING CO., LTD., SANSHIN CO., LTD.
    Inventors: Nobukazu HOSOKAI, Isamu OGURO, Jun WATANABE, Tetsujiro TADA
  • Patent number: 7927187
    Abstract: A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: April 19, 2011
    Assignee: NIHON Micro Coating Co., Ltd.
    Inventors: Jun Watanabe, Tetsujiro Tada, Takashi Arahata, Jun Tamura, Moriaki Akazawa, Masaru Sakamoto, Takahiko Kawasaki
  • Publication number: 20080293332
    Abstract: A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
    Type: Application
    Filed: May 23, 2008
    Publication date: November 27, 2008
    Applicant: NIHON MICRO COATING CO., LTD.
    Inventors: Jun Watanabe, Tetsujiro Tada, Takashi Arahata, Jun Tamura, Moriaki Akazawa, Masaru Sakamoto, Takahiko Kawasaki
  • Patent number: 6908369
    Abstract: An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: June 21, 2005
    Assignee: NIHON Microcoating Co., Ltd.
    Inventor: Tetsujiro Tada
  • Publication number: 20040072504
    Abstract: An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 15, 2004
    Applicant: Nihon Microcoating Co., Ltd.
    Inventor: Tetsujiro Tada