Abstract: The magnetic detection device includes: a first magnetic rotary body which rotates about a rotation shaft and has an outer circumferential portion which is a magnetic body; a second magnetic rotary body has an outer circumferential portion which is a magnetic body; a magnet which has a magnetization direction along the axial direction; a first magneto-resistive element provided on another side in the axial direction of the magnet; a second magneto-resistive element provided on one side in the axial direction of the magnet; a first magnetic guide provided between the magnet and the first magneto-resistive element; and a second magnetic guide provided between the magnet and the second magneto-resistive element, wherein the outer circumferential portion of the first magnetic rotary body and the outer circumferential portion of the second magnetic rotary body cause different magnetic fields between the magnet and the respective outer circumferential portions.

Abstract: A magnetic detection device includes a first magnetic sensor, a second magnetic sensor, and a resin body. The first magnetic sensor includes a first sealing body and first terminals. The second magnetic sensor includes a second sealing body and second terminals. The resin body includes a resin-body main body, first wiring lines, and second wiring lines. Each of the first wiring lines includes a first overlapping portion overlapping with corresponding one of the first terminals. As viewed in a normal direction of each of the first terminals, the first overlapping portion is arranged at a position shifted from all of the second terminals and the second wiring lines. Each of the first wiring lines is welded to corresponding one of the first terminals at the first overlapping portion.

Abstract: The magnetic detection device includes: a first magnetic rotary body which rotates about a rotation shaft and has an outer circumferential portion which is a magnetic body; a second magnetic rotary body has an outer circumferential portion which is a magnetic body; a magnet which has a magnetization direction along the axial direction; a first magneto-resistive element provided on another side in the axial direction of the magnet; a second magneto-resistive element provided on one side in the axial direction of the magnet; a first magnetic guide provided between the magnet and the first magneto-resistive element; and a second magnetic guide provided between the magnet and the second magneto-resistive element, wherein the outer circumferential portion of the first magnetic rotary body and the outer circumferential portion of the second magnetic rotary body cause different magnetic fields between the magnet and the respective outer circumferential portions.

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.

Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.

Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.

Abstract: A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.

Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.

Abstract: [Problem] To provide an antiseptic-solution concentration measuring method and equipment for easy, simple, economical and accurate measurement of the concentration of a glutaral, phtharal or similar antiseptic solution. [Means for Solving Problem] The temperature of the antiseptic solution S, such as the glutaral or phtharal solution, is measured by a thermometer, and at the same time the ultraviolet absorbance of the antiseptic solution is electrically detected by a light-receiving part 9, then a function of proportionality between the measured ultraviolet absorbance of the antiseptic solution and pre-measured ultraviolet absorbance of an undiluted antiseptic solution and a function of proportionality between the ultraviolet absorbance and concentration of said undiluted antiseptic solution are calculated by a computer to measure the concentration of the antiseptic solution S.

Abstract: A three-dimensional shape measuring apparatus includes a moving frame arranged to surround a measurement space. The moving frame is arranged to be movable in a vertical direction. A plurality of sensors is disposed opposite to each other on two opposite sides of the moving frame and are arranged to effect a horizontal scanning of light to measure distances to a human body being measured. A driving mechanism moves the moving frame. An analyzer calculates distances to the human body, based on output signals from respective sensors, to analyze data of a surface position of the human body, i.e., a three-dimensional shape thereof. The apparatus further includes a placement state on which the human body is placed. Since the sensors are located so as to face the front and the back of the human body, the apparatus can also measure portions below an armpit and below a crotch.

Abstract: A drill screw having an integral driving shank, head, and entering end portion. The shank has formed on it thread convolutions of uniform outer and root diameters. The entering end portion has a cylindrical portion coaxial with the shank provided with two flutes inclined with respect to the center axis of the cylindrical portion and disposed on opposite sides of it, and end surfaces of roof-shape. Each of the flutes includes conical flute surfaces. The intersection of each of the conical flute surfaces and each of the end surfaces forms a cutting edge. And each of the conical flute surfaces forms a rake angle with respect to one of the cutting edges, while each of the end surfaces forms a relief angle with respect to one of the cutting edges.In a preferred construction each fluted surface is located outside or beyond a plane containing the center axis of the drill screw, and the fluted surfaces each have a vertex angle of 35.degree. to 54.degree..