Abstract: Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1×106 Pa to 1×108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1×108 Pa to 1×1010 Pa. The ratio of (c) and (d) satisfies 1×104?(d)/(c)?1×10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape.

Abstract: Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.

Abstract: Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer, an intermediate layer, and a heat sealing layer having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109 ° C. according to JIS K7196, and the cover film in some instances having a release layer between the intermediate layer and the heat sealing layer.

Abstract: Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer, an intermediate layer, and a heat sealing layer having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109° C. according to JIS K7196, and the cover film in some instances having a release layer between the intermediate layer and the heat sealing layer.

Abstract: Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.

Abstract: A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×103 kg/m3, and a sealant layer comprising an ethylene-type copolymerized resin containing 50 to 85% by mass of an olefin component.

Abstract: A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) includes a resin composition which includes (a) a styrene-based resin composition and (b) an ethylene-?-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50 mass %, and which has a Vicat softening temperature of 55 to 80° C., while the heat seal layer (D) includes an acrylic resin having a glass transition temperature of 55 to 80° C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape.

Abstract: Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that is capable of being heat sealed to the carrier tape. The intermediate layer contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.

Abstract: Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1×106 Pa to 1×108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1×108 Pa to 1×1010 Pa. The ratio of (c) and (d) satisfies 1×104?(d)/(c)?1×10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape.

Abstract: A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×103 kg/m3, and a sealant layer comprising an ethylene-type copolymerized resin containing 50 to 85% by mass of an olefin component.

Abstract: To provide a cover film with which the temperature range of a sealing iron to obtain peel strength is wide and stability of peel strength is good at the time of peeling, and which is excellent in heat sealing properties to a carrier tape. A cover film comprising a substrate layer and a sealant layer, wherein the substrate layer is made of a biaxially oriented polyester and/or a biaxially oriented polypropylene, the sealant layer contains a hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene type hydrocarbon compound, the amount of the aromatic vinyl compound in the resin (a) is at least 20 mass % and at most 45 mass %, and the flowability of the resin (a) is from 1 to 20 g/10 min at a temperature of 230° C. under a load of 2.16 kgf by a measurement method stipulated in JIS K 7210.

Abstract: A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from ?9 to +9 nC when the cover tape has a surface resistivity of at least 1011 ?, and where the cover tape has a peeling static electrification amount of from ?3 to +3 nC when the cover tape has a surface resistivity of less than 1011 ?.

Abstract: A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electronic component is generated.

Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.

Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.

Abstract: A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electronic component is generated.

Abstract: In order to prevent impairment due to static electricity in a container for an electronic component, generation of static electricity itself has to be inhibited. The peeling static electrification amount of a cover tape should be from −9 to +9 nC when the cover tape has a surface resistivity of at least 1011 &OHgr;, or it should be from −3 to +3 nC when the cover tape has a surface resistivity of less than 1011 &OHgr;. In a carrier tape body, a side of a cover tape which faces an electronic component should have a composition containing a resin on the positive polarity side and a resin on the negative polarity side relative to a side of the electronic component which faces the cover tape in the series of frictional electrification. For the surface of a container to be in contact with an electronic component, a material which is less likely to generate static electricity should be employed.