Patents by Inventor Tetsuo Hidaka

Tetsuo Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010021409
    Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.
    Type: Application
    Filed: May 8, 2001
    Publication date: September 13, 2001
    Applicant: TOWA CORPORATION
    Inventors: Michio Osada, Tetsuo Hidaka, Kazuo Horiuchi
  • Patent number: 6258628
    Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: July 10, 2001
    Assignee: Towa Corporation
    Inventors: Michio Osada, Tetsuo Hidaka, Kazuo Horiuchi