Patents by Inventor Tetsuo Hiramatsu

Tetsuo Hiramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7291278
    Abstract: An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electrode having a predetermined pattern by removing the conductive layer on the adhesion preventing member in a state in which the adhesion preventing member is disposed on the base member. Adhesion between the adhesion preventing member and the conductive layer is smaller than adhesion between the base member and the conductive layer.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: November 6, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Tsuyoshi Kaneko, Tetsuo Hiramatsu
  • Patent number: 7187702
    Abstract: To provide a surface-emitting light emitting device including an optical member whose mounting position, form, and size have been favorably controlled, and a method of manufacturing the same, as well as an optical module and an optical transmission apparatus that include this surface-emitting light emitting device, the surface-emitting light emitting device of the present invention can emit light perpendicular to a substrate and includes an emitting surface that emits the light, a base member that is provided on the emitting surface, and an optical member that is provided on an upper surface of the base member.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: March 6, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Tsuyoshi Kaneko, Satoshi Kito, Tetsuo Hiramatsu
  • Patent number: 7179728
    Abstract: The invention provides an optical component whose siting, shape and size are well controlled and a method of manufacturing such an optical component. The optical component of the present invention includes a base member disposed on a substrate, and an optical member disposed on the top surface of the base member.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: February 20, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Tsuyoshi Kaneko, Satoshi Kito, Tetsuo Hiramatsu
  • Publication number: 20070025404
    Abstract: An optical element includes a surface-emitting type semiconductor laser, a photodetector element that detects a part of laser light emitted from the surface-emitting type semiconductor laser, and a light-receiving element that receives laser light from outside. The photodetector element has a first photoabsorption layer formed above a substrate. The surface-emitting type semiconductor laser has a first mirror formed above the first photoabsorption layer, an active layer formed above the first mirror, and a second mirror formed above the active layer. The light-receiving element has a second photoabsorption layer formed above the second mirror.
    Type: Application
    Filed: July 19, 2006
    Publication date: February 1, 2007
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Tetsuo HIRAMATSU
  • Publication number: 20060186396
    Abstract: An optical element has: an emission section including a first semiconductor layer of a first conductivity type, an active layer formed above the first semiconductor layer and a second semiconductor layer of a second conductivity type formed above the active layer; an interlayer dielectric layer; and an electrostatic breakdown prevention section including a first conductive layer formed above the interlayer dielectric layer, a second conductive layer formed above the interlayer dielectric layer, and an insulating member formed between the first conductive layer and the second conductive layer, and at a side of the first conductive layer and at a side of the second conductive layer, wherein the first conductive layer is electrically connected to the first semiconductor layer, the second conductive layer is electrically connected to the second semiconductor layer, at least one of the first conductive layer and the second conductive layer has a protruded section, the emission section and the electrostatic breakdo
    Type: Application
    Filed: February 7, 2006
    Publication date: August 24, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Tetsuo Hiramatsu
  • Publication number: 20050092711
    Abstract: An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electrode having a predetermined pattern by removing the conductive layer on the adhesion preventing member in a state in which the adhesion preventing member is disposed on the base member. Adhesion between the adhesion preventing member and the conductive layer is smaller than adhesion between the base member and the conductive layer.
    Type: Application
    Filed: September 7, 2004
    Publication date: May 5, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tsuyoshi Kaneko, Tetsuo Hiramatsu
  • Publication number: 20040120379
    Abstract: To provide a surface-emitting light emitting device including an optical member whose mounting position, form, and size have been favorably controlled, and a method of manufacturing the same, as well as an optical module and an optical transmission apparatus that include this surface-emitting light emitting device, the surface-emitting light emitting device of the present invention can emit light perpendicular to a substrate and includes an emitting surface that emits the light, a base member that is provided on the emitting surface, and an optical member that is provided on an upper surface of the base member.
    Type: Application
    Filed: September 12, 2003
    Publication date: June 24, 2004
    Applicant: Seiko Epson Corporation
    Inventors: Tsuyoshi Kaneko, Satoshi Kito, Tetsuo Hiramatsu
  • Publication number: 20040106223
    Abstract: The invention provides an optical component whose siting, shape and size are well controlled and a method of manufacturing such an optical component. The optical component of the present invention includes a base member disposed on a substrate, and an optical member disposed on the top surface of the base member.
    Type: Application
    Filed: August 28, 2003
    Publication date: June 3, 2004
    Applicant: Seiko Epson Corporation
    Inventors: Tsuyoshi Kaneko, Satoshi Kito, Tetsuo Hiramatsu