Abstract: A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.

Abstract: An interrupting part 2 is arranged in a vessel 1 that is filled with insulating gas to configure a puffer type gas circuit breaker. The interrupting part 2 having, at least, a main contact 3, 6 on each of fixed- and moving-sides, an arcing contact 4, 7 on each of the fixed- and moving-sides, a puffing device, and an insulative nozzle 10. The insulating gas that became high temperature by being puffed into the arcs is discharged through a puffer shaft 11 of tubular shape. The puffer shaft 11 has a pipe member 11a at the distal end of which the arcing contact 7 is installed, and an end member 11b, one end of which is separably connected to the pipe member 11a with a joint 11 and the other end of which is connected to a rod 12 that links to a manipulator side.

Abstract: A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.

Abstract: A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.