Patents by Inventor Tetsuo Jibe

Tetsuo Jibe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6004171
    Abstract: A crimp-type terminal for electrically connecting an internal conductor to a mating terminal, includes: an electrical connection portion for fitting connection to the mating terminal; a conductor clamping portion having a base plate, and upstanding walls which extend respectively from opposite side edges of the base plate, and are pressed to clamp the internal conductor; and interconnecting walls respectively connecting the upstanding walls to the electrical connection portion, wherein each of the interconnecting walls have a bend portion for absorbing a stress, produced in a direction of a width of the crimp-type terminal when the interconnecting walls are pressed, by deformation.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: December 21, 1999
    Assignee: Yazaki Corporation
    Inventors: Naoki Ito, Tetsuo Jibe, deceased
  • Patent number: 5939674
    Abstract: A waterproof structure for an electrical wiring instrument includes electrical wires, a housing, an upper cover and rubbery elastic members resulting from a pair of rubbery elastic materials. The housing has a cover portion formed on an end of the housing and provided with first accommodation grooves for accommodating the electrical wires. Each of the first accommodation grooves is defined by a pair of first ribs parallel to each other. The upper cover has second accommodation grooves formed for accommodating the electrical wires. Each of the second accommodation grooves is defined by a pair of second ribs parallel to each other. In assembling, after accommodating the wires in the first accommodation grooves, the wires are interposed between the pair of rubbery elastic materials in the form of sheets. Then, the upper cover is laid on the cover portion and subsequently subjected to ultrasonic oscillation under pressure.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: August 17, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Jibe, Akira Shinchi