Patents by Inventor Tetsuo Kitaguchi

Tetsuo Kitaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus
    Patent number: 6585853
    Abstract: A bonding apparatus has a relay stage for a chip, a bonding head, and a substrate stage. The bonding head and the substrate stage are moved relatively so that the chip is bonded to the substrate. A delivery mechanism having a retention portion for retaining the chip and the substrate is provided movably relatively to the relay stage and the substrate stage. The chip retained by the retention portion is mounted onto the relay stage, while the substrate retained by the retention portion is mounted onto the substrate stage, or while the retention portion retains the substrate mounted on the substrate stage.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: July 1, 2003
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventor: Tetsuo Kitaguchi
  • Bonding apparatus
    Publication number: 20020017367
    Abstract: A bonding apparatus has a relay stage for a chip, a bonding head, and a substrate stage. The bonding head and the substrate stage are moved relatively so that the chip is bonded to the substrate. A delivery mechanism having a retention portion for retaining the chip and the substrate is provided movably relatively to the relay stage and the substrate stage. The chip retained by the retention portion is mounted onto the relay stage, while the substrate retained by the retention portion is mounted onto the substrate stage, or while the retention portion retains the substrate mounted on the substrate stage.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 14, 2002
    Applicant: SHIBUYA KOGYO CO., LTD
    Inventor: Tetsuo Kitaguchi