Patents by Inventor Tetsuo Kurihara

Tetsuo Kurihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10767046
    Abstract: A polyamide resin molded body is formed by a resin composition having a (B) fluorine series resin within a range from 1 to 15 parts by mass with respect to 100 parts by mass of a (A) polyamide resin. In the resin composition, the number average particle diameter of the fluorine series resin dispersed in the polyamide resin is 0.8 ?m or less. The resin composition includes particles of the (B) fluorine series resin having particle diameters of 0.8 ?m or greater. The percentage of particles having particle diameters of 0.8 ?m or greater which are secondary particles while maintaining the form of primary particles is 60% or greater, and/or the degree of crystallinity of the dispersed (B) fluorine series resin is 42 J/g or greater.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: September 8, 2020
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tetsuo Kurihara, Hiroshi Oyamada, Yasuo Kawaji
  • Publication number: 20190169431
    Abstract: A polyamide resin molded body is formed by a resin composition having a (B) fluorine series resin within a range from 1 to 15 parts by mass with respect to 100 parts by mass of a (A) polyamide resin. In the resin composition, the number average particle diameter of the fluorine series resin dispersed in the polyamide resin is 0.8 ?m or less. The resin composition includes particles of the (B) fluorine series resin having particle diameters of 0.8 ?m or greater. The percentage of particles having particle diameters of 0.8 ?m or greater which are secondary particles while maintaining the form of primary particles is 60% or greater, and/or the degree of crystallinity of the dispersed (B) fluorine series resin is 42 J/g or greater.
    Type: Application
    Filed: July 3, 2017
    Publication date: June 6, 2019
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tetsuo KURIHARA, Hiroshi OYAMADA, Yasuo KAWAJI
  • Patent number: 10066104
    Abstract: The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: September 4, 2018
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Shunichiro I, Norio Sakata, Katsushi Watanabe, Tetsuo Kurihara
  • Publication number: 20170267861
    Abstract: The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.
    Type: Application
    Filed: December 25, 2015
    Publication date: September 21, 2017
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Shunichiro I, Norio SAKATA, Katsushi WATANABE, Tetsuo KURIHARA
  • Patent number: 9260585
    Abstract: (Problem to be Solved) There is provided a reinforced polyamide resin pellet that is excellent in plasticization time stabilization properties during molding and molding appearance stability under molding conditions in long-term continuous molding. (Solution) A reinforced polyamide resin pellet comprising: (A) a polyamide resin having a melting point of 200 to 270° C.; and (B) at least one inorganic filler selected from the group consisting of chopped strand glass fibers, carbon fibers, wollastonite, talc, mica, kaolin, barium sulfate, calcium carbonate, apatite, sodium phosphate, fluorite, silicon nitride, potassium titanate, and molybdenum disulfide, and wherein the pellet has a length of 1 to 5 mm and a ratio of a cross-sectional major axis to minor axis (major axis/minor axis) of 1.3 to 2.5.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: February 16, 2016
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yukiyoshi Sasaki, Tetsuo Kurihara
  • Publication number: 20140135441
    Abstract: (Problem to be Solved) There is provided a reinforced polyamide resin pellet that is excellent in plasticization time stabilization properties during molding and molding appearance stability under molding conditions in long-term continuous molding. (Solution) A reinforced polyamide resin pellet comprising: (A) a polyamide resin having a melting point of 200 to 270° C.; and (B) at least one inorganic filler selected from the group consisting of chopped strand glass fibers, carbon fibers, wollastonite, talc, mica, kaolin, barium sulfate, calcium carbonate, apatite, sodium phosphate, fluorite, silicon nitride, potassium titanate, and molybdenum disulfide, and wherein the pellet has a length of 1 to 5 mm and a ratio of a cross-sectional major axis to minor axis (major axis/minor axis) of 1.3 to 2.5.
    Type: Application
    Filed: May 23, 2012
    Publication date: May 15, 2014
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yukiyoshi Sasaki, Tetsuo Kurihara
  • Patent number: 8691898
    Abstract: It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200° C., the organic compound being from 0.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: April 8, 2014
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Hiroshi Kamo, Tetsuo Kurihara
  • Publication number: 20070270530
    Abstract: It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200° C., the organic compound being from 0.
    Type: Application
    Filed: October 7, 2005
    Publication date: November 22, 2007
    Inventors: Hiroshi Kamo, Tetsuo Kurihara
  • Patent number: 6442108
    Abstract: An information recording and/or reproducing apparatus that records desired information from a plurality of kinds of information having identification information attached thereto, the apparatus having identification information detecting means for detecting the identification information from information supplied thereto; first recording means for sequentially recording supplied information and for recording a table of contents (TOC) of the supplied information including the identification information detected by the identification information detecting means; specifying means for specifying desired information from the TOC recorded by the first recording means; and controlling means for reading the desired information specified by the specifying means from the first recording means.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: August 27, 2002
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Tetsuo Kurihara, Kazuo Kobayashi
  • Patent number: 6014718
    Abstract: A computer system comprises a computer main body including a main board on which various components such as a CPU and the like are mounted and a hard disc unit; a read-only optical disc drive provided in the computer main body; a write-only optical disc drive which is constructed separately from the read-only optical disc drive, the write-only optical disc drive being provided in the computer main body; and a bus for connecting the main board, the hard disc unit, the read-only optical disc drive, and the write-only disc drive with each other, in which the hard disc unit, the write-only optical disc drive and the read-only optical disc drive are connected by means of a cascade connection.
    Type: Grant
    Filed: July 28, 1997
    Date of Patent: January 11, 2000
    Assignee: Mitsumi Electric Co. Ltd.
    Inventor: Tetsuo Kurihara
  • Patent number: 4379486
    Abstract: A heat exchanger comprises a plurality of layered units of tube assemblies, each tube assembly unit comprising a tube made by two plates having a refrigerant inlet opening and a refrigerant outlet opening, and a spacer block is disposed between the upper and lower tube assemblies for forming an air passage having an air inlet side and an air outlet side. The refrigerant inlet opening is provided in the lower plate of the tube adjacent the air inlet side. The upper and lower tube assembly units are alternately arranged with respect to the refrigerant inlet and outlet openings. The spacer block has an opening for communicating the refrigerant outlet opening of the lower tube assembly unit with the refrigerant inlet opening of the upper tube assembly unit, such that the refrigerant mainly flows in a portion in the tube adjacent the air inlet side.
    Type: Grant
    Filed: July 28, 1980
    Date of Patent: April 12, 1983
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Tetsuo Kurihara
  • Patent number: 4337122
    Abstract: A new and useful coke oven door which is simple in construction but provides complete sealing efficiency. A pair of supporting holes are formed on each of upper and lower portions of the side plates of the door body, and through the supporting holes a locking bar extends which has on the center portion an arm for rotating and on both ends rollers eccentrically located with respect thereto. By rotating the locking bar with the arm, the door can be moved slightly backward or forward when removing or installating lest the knife edge should scratch the door sealing frame.
    Type: Grant
    Filed: December 19, 1980
    Date of Patent: June 29, 1982
    Assignee: Koritsu Machine Industries, Ltd.
    Inventor: Tetsuo Kurihara