Patents by Inventor Tetsuo Nakai

Tetsuo Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10860994
    Abstract: An information processing device includes a near field communication unit and a display. The near field communication unit repeatedly transmits a read command by sequentially switching system codes corresponding to all respective types of electronic money which are usable in the information processing device at predetermined time interval, and detects electronic money corresponding to an electronic money medium which is held over the near field communication unit. A brand of the detected electronic money and a balance of the electronic money are displayed on the display.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: December 8, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yasuhiro Nakai, Masao Saeda, Tetsuo Fukumoto
  • Patent number: 9193502
    Abstract: A packaging material 1 is configured to pack a viscous product having one surface, an opposite surface, and side surfaces. The packaging material 1 includes a sheet 2 having a first surface portion 7 configured to cover the one surface of the viscous product, side surface portions 8-1 to 8-4 configured to cover the side surfaces, and second surface portions 9-1 to 9-4 disposed at the opposite surface, and tear tape 3 adhered to the sheet to cut the sheet. The tear tape is provided to start from the side surface portion or the second surface portion and to be branched into a first branched tape 3a and a second branched tape 3b across the first surface portion.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: November 24, 2015
    Assignee: Morinaga Milk Industry Co., Ltd.
    Inventors: Tomonori Ishii, Taho Ohmura, Nobuaki Shirashoji, Tetsuo Nakai, Kazutaka Makino, Yukihiro Yamada
  • Patent number: 8556105
    Abstract: A packaging material 1 is configured to pack a viscous product having one surface, an opposite surface, and side surfaces. The packaging material 1 includes a sheet 2 having a first surface portion 7 configured to cover the one surface of the viscous product, side surface portions 8-1 to 8-4 configured to cover the side surfaces, and second surface portions 9-1 to 9-4 disposed at the opposite surface, and tear tape 3 adhered to the sheet to cut the sheet. The tear tape is provided to start from the side surface portion or the second surface portion and to be branched into a first branched tape 3a and a second branched tape 3b across the first surface portion.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: October 15, 2013
    Assignee: Morinaga Milk Industry Co., Ltd.
    Inventors: Tomonori Ishii, Taho Ohmura, Nobuaki Shirashoji, Tetsuo Nakai, Kazutaka Makino, Yukihiro Yamada
  • Publication number: 20110233212
    Abstract: A packaging material 1 is configured to pack a viscous product having one surface, an opposite surface, and side surfaces. The packaging material 1 includes a sheet 2 having a first surface portion 7 configured to cover the one surface of the viscous product, side surface portions 8-1 to 8-4 configured to cover the side surfaces, and second surface portions 9-1 to 9-4 disposed at the opposite surface, and tear tape 3 adhered to the sheet to cut the sheet. The tear tape is provided to start from the side surface portion or the second surface portion and to be branched into a first branched tape 3a and a second branched tape 3b across the first surface portion.
    Type: Application
    Filed: December 2, 2009
    Publication date: September 29, 2011
    Applicant: MORINAGA MILK INDUSTRY CO., LTD.
    Inventors: Tomonori Ishii, Taho Ohmura, Nobuaki Shirashoji, Tetsuo Nakai, Kazutaka Makino, Yukihiro Yamada
  • Patent number: 7528413
    Abstract: This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: May 5, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhito Yoshida, Hideaki Morigami, Takahiro Awaji, Tetsuo Nakai
  • Publication number: 20050051891
    Abstract: This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
    Type: Application
    Filed: October 16, 2002
    Publication date: March 10, 2005
    Inventors: Katsuhito Yoshida, Hideaki Morigami, Takahiro Awaji, Tetsuo Nakai
  • Patent number: 6737178
    Abstract: A coated sintered body can be used for a cutting tool for precision machining of hardened steel. The coated PCBN cutting tool includes a substrate which contains not less than 35 volume % and not more than 85 volume % of CBN, and a hard coated layer formed on the substrate. The hard coated layer comprises at least one compound layer consisting of at least one element selected from the group 4a, 5a, and 6a elements of the periodic table and Al, and at least one element selected from C, N and O. The thickness of the layer is not less than 0.3 &mgr;m and not more than 10 &mgr;m. The center-line mean roughness of the hard coated layer is not more than 0.1 &mgr;m.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: May 18, 2004
    Assignee: Sumitomo Electric Industries Ltd.
    Inventors: Michiko Ota, Tomohiro Fukaya, Junichi Shiraishi, Tetsuo Nakai, Hisanori Ohara, Haruyo Fukui
  • Patent number: 6635593
    Abstract: A sintered material containing high-pressure phase-type boron nitride and a binder is provided. The high-pressure phase-type boron nitride is contained in an amount of from 50% to 78% by volume, and the balance is a binder phase. The binder phase comprises at least one selected from the group consisting of nitride, carbide, carbonitride, and boride of Ti, nitride, boride and oxide of Al, carbide and boride of W, nitride, carbide, carbonitride and boride of Co, and carbide and boride of Ni, or a mutual solid solution thereof. The binder phase forms a binder phase which is continuous in a sintered material texture. The weight of metal components Al, W, Co and Ni which are present as compounds in the sintered material is from 3% to 20% based on the sintered material.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: October 21, 2003
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Satoru Kukino, Tomohiro Fukaya, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6528159
    Abstract: A diamond sintered body tool (20) having superior adhesion resistance, chipping resistance and high strength includes a tool base material (22) including a diamond sintered body, and a surface layer (21) formed on a surface of the tool base material (22). The surface layer (21) includes at least one of silicon, a silicon oxide, a silicon carbide, a silicon nitride and a solid solution thereof. The tool base material (22) has an inner portion (22b) including a first content of an iron group metal, and a surface portion (22a) surrounding the inner portion (22b ) and including a second content of the iron group metal lower than the first content.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: March 4, 2003
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuyuki Kanada, Yoshihiro Kuroda, Noboru Yamazaki, Yasunobu Ogata, Kunihiro Tomita, Tetsuo Nakai, Makoto Abe
  • Patent number: 6358624
    Abstract: The present invention provides a diamond sintered compact tool. Which is excellent in economy as well as cutting edge strength. A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC—Co cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC—Co cemented carbide substrate, in which a ratio of the thickness of the WC—Co cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relation of: 0.8≦WC—Co cemented carbide substrate/diamond sintered compact layer≦3.0 and the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0.05 mm to 0.45 mm, more preferably 0.12 mm to 0.36 mm.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: March 19, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhito Yoshida, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6342301
    Abstract: The present invention aims at providing a material for a diamond sintered compact tool, which has a high strength and is available as a material for a cutting tool. Accordingly, the present invention is concerned with a diamond sintered compact comprising a WC-Co type cemented carbide substrate having slight undulation and a diamond sintered compact bonded to one surface of the substrate by sintering during a step of sintering at an ultra-high pressure and high temperature, which has a plate thickness is 0.5 mm to 5 mm and an outer diameter is at least 20 mm and whose diamond sintered compact layer has at least 50% of a thickness area within a range of 0.05 mm to 0.4 mm and contains Co diffusing from the cemented carbide substrate.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: January 29, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhito Yoshida, Michinari Asano, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6337152
    Abstract: A cutting tool according to the present invention is coated with one or more Al2O3 layers on at least a part of the surface of a cBN-based sintered material substrate taking part in cutting. The sintered material substrate is made of cBN in an amount of from 20% to 99% by volume and Al2O3 having an average crystalline particle diameter of not more than 1 &mgr;m in an amount of from not less than 1.0% to less than 10% by volume. The Al2O3 layer has a thickness (d) of from 0.5 &mgr;m to 50 &mgr;m. The average crystalline particle diameter (s) of Al2O3 is from 0.01 &mgr;m to 4 &mgr;m if the thickness (d) of the Al2O3 layer is from 0.5 &mgr;m to 25 &mgr;m or from not less than 0.01 &mgr;m to not more than 10 &mgr;m if the thickness (d) of the Al2O3 layer is from more than 25 &mgr;m to 50 &mgr;m.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: January 8, 2002
    Assignee: Sumitomo Electric Industries, Inc.
    Inventors: Satoru Kukino, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6302225
    Abstract: A polycrystal diamond tool is provided whose heat resistance, strength and anti-adhesion property are improved by modifying the porosity of a diamond sintered compact and which comprises a diamond sintered compact, sintered under ultra-high pressure and high temperature, brazed onto a tool substrate, in which the cutting edge vicinity part consists of 85 to 99 volume % of the diamond sintered compact material consisting of diamond grains bonded with each other and the balance of pores, and the other part than the cutting edge vicinity part consists of diamond grains and the balance of a brazing material.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: October 16, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhito Yoshida, Yasunobu Ogata, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6265337
    Abstract: A sintered body contains a high pressure form boron nitride in the range of 20 to 70% by volume, a first binding material surrounding the high pressure form boron nitride with a thickness in the range of 5 nm to 300 nm and a second binding material of the balance. The first binding material is composed of at least one of nitride and boride of Ti and Al. The second binding material is composed of at least one selected from the group consisting of nitride, carbide, carbonitride, boride and oxide of Al and transition metals belonging to the group 4a, 5a and 6a in the periodic table and mutual solid solution thereof. Supposing that X is the amount of Al contained per unit volume in the first binding material and Y is the amount of Al contained per unit volume in the second binding material, the ratio X/Y is not less than 1.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: July 24, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Satoru Kukino, Tomohiro Fukaya, Junichi Shiraishi, Tetsuo Nakai
  • Patent number: 6261329
    Abstract: A diamond sintered body having high wear resistance, chipping resistance, shock resistance and thermal conductivity is provided. The diamond sintered body includes sintered diamond particles and a sintering aid as the remainder. The content of the sintered diamond particles is at least 80% by volume and less than 99% by volume. The sintered diamond particles have a particle size in the range from at least 0.1 &mgr;m to at most 70 &mgr;m. The sintered diamond particles next to each other are directly bonded. The sintering aid includes at least one kind selected from tungsten, iron, cobalt and nickel. The percentage of the tungsten in the sintered body is in the range from at least 0.01% by weight to at most 8% by weight.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: July 17, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasunobu Ogata, Satoru Kukino, Yasuyuki Kanada, Junichi Shiraishi, Tetsuo Nakai
  • Publication number: 20010003569
    Abstract: The present invention provides a coated sintered body which can be used in precious machining hardened steel. The coated PCBN cutting tool comprises a substrate which contains not less than 35 volume % and not more than 85 volume % of CBN, and a hard coated layer formed on the substrate. The hard coated layer comprises at least one compound layer consisting of at least one element selected from a group of 4a, 5a, 6a elements of the periodic table and Al, and at least one element selected from a group of C, N and O. The thickness of the layer is not less than 0.3 &mgr;m and not more than 10 &mgr;m. The center-line mean roughness of the hard coated layer is not more than 0.1 &mgr;m.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 14, 2001
    Inventors: Michiko Ota, Tomohiro Fukaya, Junichi Shiraishi, Tetsuo Nakai, Hisanori Ohara, Haruyo Fukui
  • Patent number: 6155755
    Abstract: A tool manufactured by brazing a hard sintered body such as a diamond or cBN to a tool substrate through a bonding layer comprising at least one of Ti and Zr by 15-65 wt % and Cu. Two ridges of the tool substrate on both sides each has a first ridge adjacent to and aligned with a ridge of the hard sintered body and a second ridge provided nearer to an inscribed circle of the tool than is the ridge of the hard sintered body. Also, an upright side face and a bottom of each seating groove formed in the tool substrate intersect each other at an angle smaller than the intersecting angle between a back side and a bottom of each hard sintered body.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: December 5, 2000
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuyuki Kanada, Kunihiro Tomita, Tetsuo Nakai
  • Patent number: 6065377
    Abstract: A method of cutting hardened steel using a cBN sintered tool which can improve the surface roughness while maintaining high dimensional accuracy. The upper limit of the tool feed rate is set at such a value that a theoretical surface roughness calculated from the feed rate is between 2/3 and 1/1000 of the target surface roughness. The amount of change of the feed rate between the upper and lower limits of the tool feed rate is set to be between 0.002 and 0.05 mm/rev, and the amount of every feed rate change is set not to be equal to the original feed rate multiplied by an integer. The feed rate is changed forcibly for every number of workpieces for which the total cutting length is between 10 and 1000 meters.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: May 23, 2000
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Harada, Tetsuo Nakai, Tomohiro Fukaya, Junichi Shiraishi
  • Patent number: 6008153
    Abstract: A high-pressure phase boron nitride-based high-hardness high-strength sintered body for cutting tools represented by a milling tool and an end mill etc., which is improved in wear resistance and chipping resistance, is obtained. The high-pressure phase boron nitride-based sintered body according to the present invention comprises a plurality of grains (1) of high-pressure phase boron nitride and a binder phase (2, 3), and the content of the aforementioned grains (1) is at least 20.0 volume % and not more than 99.7 volume %. The aforementioned binder phase (2, 3) includes a first binder phase (2) enclosing the aforementioned grains (1) and a second binder phase (3) other than that. The first binder phase (2) consists of the form of at least either a nitride of at least one of Ti, TiAl, Zr and Hf or a solid solution thereof.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: December 28, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Satoru Kukino, Tetsuo Nakai, Junichi Shiraishi, Tomohiro Fukaya, Shinya Uesaka
  • Patent number: 6001758
    Abstract: A sintered body consists of high-pressure phase boron nitride, a residual binder phase and an unavoidable impurity, and contains high-pressure phase boron nitride powder which is previously coated with a binder before sintering. The coating binder consists of an element belonging to the group 4a, 5a or 6a of the periodic table or the like, and has an average thickness of 5 to 300 nm. Binder powder other than the coating binder consists of an element belonging to the group 4a, 5a or 6a of the periodic table or the like, and a contact ratio of high-pressure phase boron nitride particles in surface-to-surface contact with each other is at least 20% and less than 50%. The resulting high-pressure phase boron nitride-based hard and tough sintered body for a cutting tool is improved in wear resistance and chipping resistance.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: December 14, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tomohiro Fukaya, Tetsuo Nakai, Junichi Shiraishi, Satoru Kukino, Shinya Uesaka