Abstract: The invention provides a method for releasing a first polymer film, wherein a layered body is prepared by adhering, to each other, an inorganic substrate and a first polymer film on which an electronic device has been formed; the first polymer film side of the layered body is placed and fixed so as to be in contact with a vacuum suction plate, a partition wall is provided on a side surface of the layered body, and a second polymer film that is larger than the inorganic substrate is layered onto the inorganic substrate side of the layered body, so as to provide an enclosed space formed by the vacuum suction plate, the second polymer film, and the partition wall; and a releasing portion is provided between the first polymer film and the inorganic substrate and air is injected into this releasing portion to release the first polymer film.

Abstract: An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 ?m.

Abstract: This method for producing a layered body includes: a step A for preparing a first layered body by layering a first resin film and a patterned metal layer; a step B for preparing a second resin film having indentations corresponding to the metal layer pattern; and a step C for mating the metal layer pattern and the indentations in the second resin film and bonding together the first layered body and second resin film.

Abstract: The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.

Abstract: Provided is a laminated film that includes a heat-resistant polymer film and a first protective film laminated on one of the surfaces of the heat-resistant polymer film, wherein: the first protective film has a first substrate and a first adhesive layer provided on the first substrate; the first substrate, the first adhesive layer, and the heat-resistant polymer film are laminated in this order; the first substrate is a polyester film or a polyolefin film; the first adhesive layer contains a urethane-based resin; and the maximum diameter of a gelled product in the first adhesive layer is equal to or less than 14 ?m.

Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.

Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.

Abstract: Provided is a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, the laminate having stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in the case of a large surface area, and having few blister defects. This laminate has an inorganic substrate, a silane coupling agent layer that includes amino groups, and a heat-resistant polymer film in the stated order, the laminate being characterized in that the elemental nitrogen component ratio in an inorganic-substrate-side peel surface after the heat-resistant polymer film has been peeled from the inorganic substrate at 90° is greater than 3.5 at % and no greater than 11 at %.

Abstract: Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 µm.

Abstract: The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.

Abstract: The purpose of the present invention is to provide a storage state in which a reactive compound layer can be stably maintained in a polymer film having a reactive compound layer on the surface. The film roll is obtained by winding together: a first polymer film having a reactive compound layer on the surface, and a second polymer film having a surface roughness (Ra) of 0.1 ?m or more and a modulus of elasticity of 300 MPa or more and 10 GPa or less. The film bundle is obtained by laminating the first and second polymer films. Preferably, storing the film roll and the film bundle at a low temperature enables a thin layer of a reactive compound to be stably maintained.

Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.

Abstract: This apparatus for manufacturing a laminate comprises: a first sheet transporting device for transporting a first sheet; a water supply device for supplying an aqueous medium to the surface of the first sheet coated with a silane coupling agent and/or the surface of a second sheet coated with a silane coupling agent; and a laminating device for attaching the first sheet and the second sheet which have been supplied with the aqueous medium.

Abstract: The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.

Abstract: [Problem] To provide a polyimide film laminated substrate in which stable peeling with a constant low force from an inorganic substrate is enabled when a polyimide film is to be peeled from an inorganic substrate even after heat treatment at a temperature exceeding 500° C. is performed. [Solution] Silane coupling agent treatment is performed on an inorganic substrate on which a thin film of an aluminum oxide, a thin film of a composite oxide of aluminum and silicon, a thin film of molybdenum or tungsten, or an alloy thin film of molybdenum and tungsten is formed continuously or discontinuously on a part of at least one surface thereof, and a polyimide film layer is further laminated on the silane coupling agent layer. In the obtained laminate, the part where the aluminum oxide thin film layer is present functions as an easily-peelable layer, the part where no aluminum oxide thin film layer functions as an easily-bondable part.

Abstract: A method for manufacturing a device connected body, including: a step A for readying a first laminate having, in the order listed, an inorganic substrate, a resin layer, and a plurality of devices mounted on the resin layer so that a gap is present therebetween; a step B for forming, on the first laminate, an elastomer layer so as to cover the plurality of devices and the gap portion and obtaining a second laminate; and a step C for peeling the inorganic substrate. The resin layer is either formed as a plurality of resin layers in advance at least at positions corresponding to the plurality of devices, or formed as a plurality of resin layers at least at positions corresponding to the plurality of devices by removing a part of the resin layer after step C for peeling the inorganic substrate.

Abstract: A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.

Abstract: A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.

Abstract: The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of 50/m2 or less, an average height of blisters of 2 ?m or less, a product of the number density of the blisters (blisters/m2) and the average height of the blisters (?m) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600° C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.

Abstract: It is provided that a polymer film; a preparation method of the polymer film; and a laminated body used the polymer film. The polymer film is suitable for use in producing a laminate body which comprises a support and a polymer film, and is reduced in foreign-matter trapping and which can be used for supplying film devices using conventional apparatuses for glass substrates or silicon substrates. The polymer film coated with the layer of silane coupling agent, which is suitable for producing a laminate that comprises a support and a polymer film, comprises a silane coupling agent layer formed on at least one surface of the polymer film, wherein the silane coupling agent layer has a three-dimensional surface roughness (Sa) of 5.0 nm or less. The method of efficient for producing the polymer film coated with the above layer is the method for producing without using a vacuum.