Patents by Inventor Tetsuo Tsukamoto

Tetsuo Tsukamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of, and apparatus for manufacturing a gear with a central through hole
    Patent number: 5516376
    Abstract: A hardened surface layer is formed in the region of inner and outer surfaces of a hollow material having a central through hole, then the hollow material is hot-forged into a hollow gear-like forged body by a forging die having a first die element with a piercing punch entering into the central through hole of the hollow material from one side thereof and having a second die element with a piercing punch entering into the central through hole of the hollow material from another side thereof. The forging die forms teeth of the gear on the outer side of the hollow material while producing an annular flash in the central through hole of the hollow material between the piercing punches. A distance between the piercing punches in a closed condition of the forging die defines a thickness of the annular flash which is 0.3 mm or more and no greater than 1.3 times (130%) of a depth of the hardened surface layer.
    Type: Grant
    Filed: May 24, 1994
    Date of Patent: May 14, 1996
    Assignees: Nissan Motor Co., Ltd., Nittan Valve Co., Ltd.
    Inventors: Tetsuo Tsukamoto, Kiyoshi Ohkawachi, Shinji Fushimi, Shunzo Umegaki, Takashi Matsumoto
  • Metal-bonding adhesive compositions
    Patent number: 4101534
    Abstract: A metal-bonding adhesive composition consisting essentially of 95 - 60% by weight, based on the total composition, of an aliphatic homopolyamide and 5 - 40% by weight, based on the total composition, of an aliphatic copolyamide, said homopolyamide being a crystalline homopolyamide having up to 14 amide groups per 100 carbon atoms, and said copolyamide consisting of 90 - 70% by weight of (1) a polyamide having up to 14 amide groups per 100 carbon atoms and 10 - 30% by weight of (2) at least one polyamide whose recurring units are different from those of said polyamide (1), and a metallic can body composed of a metal blank, both side end portions of which are bonded by the side-lap-seam interposed by a layer of said adhesive composition.
    Type: Grant
    Filed: July 13, 1972
    Date of Patent: July 18, 1978
    Assignee: Toyo Seikan Kaisha Limited
    Inventors: Hiroshi Ueno, Shinya Otsuka, Tetsuo Tsukamoto, Akira Kishimoto
  • Homopolyamide and terpolyamide blend
    Patent number: 3937752
    Abstract: An adhesive composition for bonding together metal sheets in an extremely short time, which is an intimate mixture of (I) nylon 66, nylon 6, nylon 610, nylon 11 or nylon 12 and (II) a semicrystalline copolyamide such as a copolyamide of hexamethylene diammonium adipate, hexamethylene diammonium sebacate and 6-amino-caproic acid, in a ratio by weight of (I):(II) from 99:1 to 90:10.
    Type: Grant
    Filed: December 6, 1972
    Date of Patent: February 10, 1976
    Assignee: Toyo Seikan Kabushiki Kaisha
    Inventors: Hiroshi Ueno, Tetsuo Tsukamoto