Patents by Inventor Tetsuro HIROKI

Tetsuro HIROKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692098
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: July 4, 2023
    Assignee: UBE CORPORATION
    Inventors: Yuya Miki, Tetsuro Hiroki, Masayoshi Baba
  • Publication number: 20230131836
    Abstract: This is to achieve low temperature toughness in a blow molded product, blow molding properties such as mold transferability, suppression of burning, suppression of surface unevenness, drawdown property and dimensional stability of the blow molded product, and blister resistance in combination. A polyamide resin composition of the present invention comprises 60 to 85% by mass of a polyamide resin (A), 20% by mass or more of an olefin-based ionomer (B) and 5 to 20% by mass of an impact resistant material (C) in 100% by mass of the polyamide resin composition, and contains 20% by mass or more of an aliphatic copolymerized polyamide (A-1) in 100% by mass of the polyamide resin (A).
    Type: Application
    Filed: October 28, 2020
    Publication date: April 27, 2023
    Applicant: UBE CORPORATION
    Inventors: Tetsuro HIROKI, Tetsuya YASUI
  • Publication number: 20220325102
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Inventors: Yuya MIKI, Tetsuro HIROKI, Masayoshi BABA
  • Publication number: 20210139699
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes: a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C.; wherein the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Application
    Filed: August 10, 2018
    Publication date: May 13, 2021
    Inventors: Yuya MIKI, Tetsuro HIROKI, Masayoshi BABA