Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a heater part, and a bypass part. The ceramic dielectric substrate includes a substrate upper surface and a substrate lower surface. The heater part is disposed between the substrate upper surface and the substrate lower surface. The heater part includes at least one heater layer. The heater part includes a heater upper surface and a heater lower surface. The bypass part includes a first bypass portion disposed lower than the substrate lower surface. The first bypass portion including a first bypass upper surface and a first bypass lower surface. A second distance between the heater lower surface and the first bypass upper surface is greater than a first distance between the heater upper surface and the substrate upper surface.

Abstract: An electrostatic chuck includes a base plate, a first heater element, and a plurality of first power feeding terminals. The base plate includes a communicating path having a spiral shape. The first heater element includes a plurality of first zones. The plurality of first power feeding terminals feeds power to the plurality of first zones. Each of the plurality of first zones includes a first heater line and a pair of first power feeding portions feeding power to the first heater line. The pair of first power feeding portions is electrically connected to the plurality of first power feeding terminals. The plurality of first power feeding terminals includes a first and a second annular portion. The communicating path includes a first circumferential portion surrounding the second annular portion between the first annular portion and the second annular portion when viewed along a stacking direction.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.

Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a porous part. The ceramic dielectric substrate has a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, and a through hole provided from the second to first major surface. The base plate supports the ceramic dielectric substrate and includes a gas introduction path communicating with the through hole. The porous part is provided in the gas introduction path. The porous part includes sparse portions including pores and a dense portion having a higher density than the sparse portions. Each of the sparse portions extends in a first direction from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include the pores and a wall portion provided between the pores.

Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a porous part. The ceramic dielectric substrate has a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, and a through hole provided from the second to first major surface. The base plate supports the ceramic dielectric substrate and includes a gas introduction path communicating with the through hole. The porous part is provided in the gas introduction path. The porous part includes sparse portions including pores and a dense portion having a higher density than the sparse portions. Each of the sparse portions extends in a first direction from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include the pores and a wall portion provided between the pores.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.

Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.

Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.