Patents by Inventor Tetsuro Kubo

Tetsuro Kubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8658910
    Abstract: A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: February 25, 2014
    Assignee: Panasonic Corporation
    Inventors: Tetsuro Kubo, Tsuyoshi Himori, Shogo Hirai
  • Publication number: 20130153276
    Abstract: A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.
    Type: Application
    Filed: June 7, 2012
    Publication date: June 20, 2013
    Inventors: Tetsuro Kubo, Tsuyoshi Himori, Shogo Hirai