Patents by Inventor Tetsuro Maeda
Tetsuro Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110311831Abstract: A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W/mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member.Type: ApplicationFiled: November 25, 2008Publication date: December 22, 2011Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Motohiro Suzuki, Naomi Yonemura, Yoshihiko Okajima, Tetsuro Maeda, Eiji Yoshimura
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Publication number: 20110284914Abstract: A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.Type: ApplicationFiled: November 25, 2008Publication date: November 24, 2011Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Motohiro Suzuki, Naomi Yonemura, Yoshihiko Okajima, Tetsuro Maeda, Eiji Yoshimura
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Publication number: 20110272731Abstract: This invention provides a substrate for a light emitting element package that can obtain a sufficient heat dissipation effect from a light emitting element and can also lower the costs and reduce the size as a substrate for packaging the light emitting element, as well as a light emitting element package using the same. The substrate for a light emitting element package includes an insulating layer 1 composed of a resin 1a containing heat conductive fillers 1b, 1c, a thick metal section 2 formed under a mounting position of a light emitting element 4, and a surface electrode section 3 formed on a mounting side of said insulating layer 1 separately from said thick metal section 2.Type: ApplicationFiled: October 31, 2008Publication date: November 10, 2011Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Motohiro Suzuki, Naomi Yonemura, Tetsuro Maeda, Eiji Yoshimura
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Patent number: 6459699Abstract: In an ATM switching module, expansion interfaces are connected in pair to an ATM switch to respectively operate in active and standby states. When another ATM switching module is installed and a connection is established between an expansion interface of standby state and the newly installed ATM switching module, a process sets the standby state expansion interface in hot-standby state, and holds off incoming ATM cells destined for the hot-standby state expansion interface until the connection is ready to accept cell traffic, whereupon the hot-standby state expansion interface is switched to active state, whereby the ATM switch and an ATM switch of the another switching module constitute a multi-stage configuration.Type: GrantFiled: May 20, 1999Date of Patent: October 1, 2002Assignee: NEC CorporationInventors: Toshiharu Kimura, Tetsuro Maeda
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Patent number: 6137975Abstract: A developing device is provided with developing unit covers mounted on opening portions of developing units through which developing rollers are exposed to close the opening portions. Due to such a construction, even when the developing units receive the vibration or the impact of falling during the course of transportation of an image forming apparatus on which the developing device is mounted, the overflow of a developer through the opening portion can be prevented.Type: GrantFiled: May 28, 1999Date of Patent: October 24, 2000Assignee: Fuji Xerox Co., Ltd.Inventors: Katsumi Harumoto, Toyohiko Awano, Tetsuro Maeda, Shigemasa Nakaya, Toshio Uchida
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Patent number: 6104898Abstract: A rotary developing device which facilitates a positional adjustment of developing units and prevents the developing units from being shifted even when they are used for a long period. Pins protruding from a revolver are inserted into elongated holes formed in developing units so that developing units are held in such a manner that the developing units are movable relative to the revolver. By mounting a spacer between the elongated hole and the pin, the positional adjustment of the photosensitive drum and the tracking roller is completed. Furthermore, a plurality of spacers which differ in thickness are prepared and by merely selectively mounting an appropriate spacer, the position adjustment of the tracking roller is completed.Type: GrantFiled: August 16, 1999Date of Patent: August 15, 2000Assignee: Fuji Xerox Co., Ltd.Inventors: Toyohiko Awano, Tetsuro Maeda, Shigeki Nishimura, Shigemasa Nakaya, Takeshi Fukuda, Katsumi Harumoto, Toshio Masubuchi
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Patent number: 5909976Abstract: A brush-equipped container for a cyanoacrylate adhesive, the container comprising: a container main body comprising a polyolefin resin; and a cap for capping the container main body, which has a brush member provided on the inner side of the cap so that the brush member is housed in the container main body, the brush member comprising a handle and bristles, wherein at least the container main body is coated with a gas-impermeable coating material which is insoluble in the cyanoacrylate and which has poor adhesion property with respect to the cyanoacrylate.Type: GrantFiled: January 28, 1998Date of Patent: June 8, 1999Assignee: Three Bond Co., Ltd.Inventor: Tetsuro Maeda
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Patent number: 4965315Abstract: A thermoplastic resin composition composed of a mixture comprising a graft polymer obtained by subjecting a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer to emulsion polymerization in the presence of a diene rubber latex, and a hard polymer obtained by copolymerizing a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer, in which the number average particle size Dn of diene rubber particles contained in the composition is at most 0.1 .mu.m, the ratio (Dw/Dn) of the weight average particle size Dw to the number average particle size Dn of the diene rubber particles is at least 5.0, the graft rate of said graft polymer is at least 60%, and the content of an emulsifier and a reaction product of an emulsifier is not higher than 2% by weight.Type: GrantFiled: April 23, 1985Date of Patent: October 23, 1990Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuro Maeda, Akihiro Okamoto
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Patent number: 4876145Abstract: A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.Type: GrantFiled: July 10, 1987Date of Patent: October 24, 1989Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuro Maeda, Fukuaki Wada, Susumu Ohoka, Akihiro Okamoto
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Patent number: 4812516Abstract: A polymer composition obtained by mixing, in an emulsion state,(A) from 20 to 90% by weight (as solid content of polymer) of an emulsion of polymer component (A) which is a polymer of a vinyl monomer and has a glass transition temperature of higher than 20.degree. C., a gel content of not higher than 10% and a solubility parameter of from 8.0 to 11.0 (cal/cc) .sup.1/2 and which has a weight average molecular weight, based on polystyrene, of at least 1.5.times.10.sup.5, and(B) from 10 to 80% by weight (as solid content of polymer) of an emulsion of polymer component (B) which is a homopolymer of an acrylate monomer, a copolymer of acrylate monomers or a copolymer of an acrylate monomer with other copolymerizable monomer and has a glass transition temperature of not higher than 20.degree. C., a gel content of not higher than 70% and a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2,and separating the polymer from the emulsion mixture.Type: GrantFiled: June 1, 1988Date of Patent: March 14, 1989Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventor: Tetsuro Maeda
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Patent number: 4774291Abstract: A polymer composition obtained by mixing, in an emulsion state,(A) from 20 to 90% by weight (as solid content of polymer) of an emulsion of polymer component (A) which is a polymer of a vinyl monomer and has a glass transition temperature of higher than 20.degree. C., a gel content of not higher than 10% and a solubility parameter of from 8.0 to 11.0 (cal/cc).sup.1/2 and which has a weight average molecular weight, based on polystyrene, of at least 1.5.times.10.sup.5, and(B) from 10 to 80% by weight (as solid content of polymer) of an emulsion of polymer component (B) which is a homopolymer of an acrylate monomer, a copolymer of acrylate monomers or a copolymer of an acrylate monomer with other copolymerizable monomer and has a glass transition temperature of not higher than 20.degree. C., a gel content of not higher than 70% and a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2,and separating the polymer from the emulsion mixture.Type: GrantFiled: December 19, 1986Date of Patent: September 27, 1988Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventor: Tetsuro Maeda
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Patent number: 4740553Abstract: A thermoplastic resin composition composed of a mixture comprising:(A) from 5 to 94% by weight of an elastomer-containing styrene resin comprising an elastomer component and a resin component having a glass transition temperature of higher than 20.degree. C., with a covalent substance of the elastomer and resin components being present at the interface between the elastomer component constituting a dispersed phase and the resin component constituting a continuous phase;(B) from 5 to 94% by weight of a polycarbonate resin; and(C) from 0.1 to 20% by weight of a polymer of a monomer containing an acrylate monomer having a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2, a glass transition temperature of not higher than 20.degree. C. and a gel content of not higher than 70% by weight.Type: GrantFiled: October 8, 1986Date of Patent: April 26, 1988Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventor: Tetsuro Maeda
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Patent number: 4732807Abstract: A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.Type: GrantFiled: February 11, 1985Date of Patent: March 22, 1988Assignee: Denki Kagaku Kogyo K.K.Inventors: Tetsuro Maeda, Fukuaki Wada, Susumu Ohoka, Akihiro Okamoto
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Patent number: 4612253Abstract: Disclosed is a wet-platable acrylonitrilebutadiene-styrene resin (ABS resin) composition comprising 100 parts by weight of an ABS resin and 0.1 to 10 parts by weight of a compound represented by the following general formula [I]: ##STR1## wherein R.sub.1 stands for an alkyl group, R.sub.2 and R.sub.3 each stand for a hydrogen atom or a methyl group, R.sub.4 and R.sub.5 stand for a hydrogen atom or a group --C(O)R.sub.6 in which R.sub.6 stands for an alkyl group, and m and n are integers of from 1 to 20.A plated resin article having an improved plating adhesion can be obtained by wet-plating a molded article formed from this ABS resin composition.Type: GrantFiled: March 15, 1985Date of Patent: September 16, 1986Assignee: Denki Kagaku Kogyo K. K.Inventors: Tetsuro Maeda, Kyoji Onaya, Akihiro Okamoto
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Patent number: 4533698Abstract: A thermoplastic resin composition consists essentially of (A) 100 parts by weight of a rubber-containing styrene type resin and (B) 1 to 45 parts by weight of a polymeric substance selected from the group consisting of a homopolymer of an acrylic acid ester, copolymers of an acrylic acid ester, and a mixture of these polymers, said component (B) having a solubility parameter of from 8.4 to 9.8 (cal/c.c.).sup.1/2, a glass transition temperature of 20.degree. C. or below, a gel content of 70% by weight or below, and relative viscosity of a substance soluble in methylethyl ketone of 20 or below.Type: GrantFiled: April 6, 1983Date of Patent: August 6, 1985Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuro Maeda, Akihiro Okamoto, Yoshimitsu Shimizu, Takashi Nomoto
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Patent number: 4476266Abstract: (1) A graft copolymer latex obtained by the copolymerization of a rubbery diene polymer latex with an aromatic vinyl monomer and an acrylic monomer is mixed with (2) a copolymer latex having a glass transition point of -40.degree. to 10.degree. C. and a volume-average particle size of at least 0.5.mu. obtained by the copolymerization of an olefin with a vinyl ester of a fatty acid while they are maintained in the form of latex to precipitate a solid resin, whereby a thermoplastic resin composition is obtained. The total solid resin contains at least 11 wt. % of the rubbery diene polymer and at least 1 wt. % of the copolymer of olefin/vinyl ester of fatty acid.Type: GrantFiled: November 10, 1982Date of Patent: October 9, 1984Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuro Maeda, Susumu Ohoka, Masafumi Shingai, Haruo Igawa
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Patent number: 4461865Abstract: An ABS resin composition comprises 100 parts by weight of an ABS resin having a melt index of at least 4.0 g/10 min. and a rubber content of from 10 to 28% by weight and from 0.5 to 30 parts by weight of powder of at least one metal selected from aluminum, copper and an copper alloy.Type: GrantFiled: August 13, 1982Date of Patent: July 24, 1984Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuro Maeda, Yasuo Yoshii, Akihiro Okamoto, Isamu Nishinakagawa
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Patent number: D408444Type: GrantFiled: May 26, 1998Date of Patent: April 20, 1999Assignee: Fuji Xerox Co., Ltd.Inventor: Tetsuro Maeda
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Patent number: D418156Type: GrantFiled: May 26, 1998Date of Patent: December 28, 1999Assignee: Fuji Xerox Co., Ltd.Inventor: Tetsuro Maeda