Abstract: An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 ?m, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.

Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3·yMg(OH)2·zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

Abstract: A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO3.yMg(OH)2.zH2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

Abstract: It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

Abstract: It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

Abstract: There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O??(1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.

Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Abstract: There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance.