Patents by Inventor Tetsuro Ogushi

Tetsuro Ogushi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8371367
    Abstract: A heat sink includes a base having a first surface thermally connected to a heat producing component and a plurality of fins supported by a second surface of the base and arranged in a predetermined direction, each fin having a plurality of through-holes. The base and the plurality of fins are integrally formed from a porous material, for example a lotus-shaped porous material. The heat sink is placed within a duct. The heat sink may have a width of about 10 mm or less.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: February 12, 2013
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Osaka University
    Inventors: Hiroshi Chiba, Tetsuro Ogushi, Hideo Nakajima
  • Patent number: 7960874
    Abstract: A cooling device of a linear motor to cool a primary side of the linear motor including an iron core and a coil accommodated in slots of the iron core, including an elongate cover covering coil end portions exposed from both side faces of the iron core in a longitudinal direction, an air channel serving as blower for forcing a current of cooling air inside the cover, and a partition plate dividing the inside of the cover into upper and lower spaces. It is configured in such a manner that the upper space divided by the partition plate is used as a ventilation portion through which a current of cooling air is forced and the lower space is used as a cooling portion in which the coil end portions are accommodated and cooled. A slit is formed almost along a full length of the partition plate on a side closer to the iron core for bringing the ventilation portion and the cooling portion into communication with each other, and a vent is provided in a lower portion of the cooling portion.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: June 14, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Haruhiro Oda, Toshinori Nakagawa, Tetsuro Ogushi
  • Patent number: 7841387
    Abstract: A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: November 30, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
  • Patent number: 7810551
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: October 12, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Publication number: 20100139904
    Abstract: A heat sink (2) has a base (4) having a first surface (4a) thermally connected to a heat producing body and also has fins (6a-6d) each having through-holes (8), the fins being supported by a second surface (4b) of the base (4) and arranged in a predetermined direction. The base (4) and the fins (6a-6d) are integrally formed of a porous material (lotus-type porous material). The heat sink (2) is placed in a duct (80). It is preferable that the width (W) of the heat sink (2) is substantially equal to or less than 10 mm.
    Type: Application
    Filed: August 11, 2005
    Publication date: June 10, 2010
    Applicant: Osaka University
    Inventors: Hiroshi Chiba, Tetsuro Ogushi, Hideo Nakajima
  • Patent number: 7721793
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: May 25, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Publication number: 20100066179
    Abstract: A cooling device of a linear motor to cool a primary side of the linear motor including an iron core and a coil accommodated in slots of the iron core, including an elongate cover covering coil end portions exposed from both side faces of the iron core in a longitudinal direction, an air channel serving as blower for forcing a current of cooling air inside the cover, and a partition plate dividing the inside of the cover into upper and lower spaces. It is configured in such a manner that the upper space divided by the partition plate is used as a ventilation portion through which a current of cooling air is forced and the lower space is used as a cooling portion in which the coil end portions are accommodated and cooled. A slit is formed almost along a full length of the partition plate on a side closer to the iron core for bringing the ventilation portion and the cooling portion into communication with each other, and a vent is provided in a lower portion of the cooling portion.
    Type: Application
    Filed: December 21, 2006
    Publication date: March 18, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Haruhiro Oda, Toshinori Nakagawa, Tetsuro Ogushi
  • Patent number: 7545642
    Abstract: A large number of ventilating apertures that have a circular cross section are disposed through the heatsink so as to extend from an air intake apertured surface to an air discharge apertured surface so as to have aperture directions that are parallel to each other and parallel to an element mount surface, and the heatsink is disposed such that the air intake apertured surface faces an air intake aperture and the aperture directions of the ventilating apertures are aligned in a direction of flow of a cooling airflow.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: June 9, 2009
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuaki Uehara, Tetsuro Ogushi, Yoshihito Asao, Hitoshi Isoda
  • Publication number: 20090114372
    Abstract: A heat sink includes a heat-transfer container incorporating a flow path through which a cooling fluid flows, for cooling a heating element in contact with the heat-transfer container The flow path includes a first cross-sectional portion that becomes narrower as the distance between a given point in the flow path and a side of the heat-transfer container which makes contact with the heating element becomes longer in a direction perpendicular to the direction in which the cooling fluid flows, and a second cross-sectional portion that is approximately constant in the direction perpendicular to the direction in which the cooling fluid flows. The first cross-sectional portion and the second cross-sectional portion alternately continue in the direction in which the cooling fluid flows causing a three-dimensional flow so the heat-transfer properties are enhanced with a simplified structure.
    Type: Application
    Filed: September 13, 2005
    Publication date: May 7, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Seiji Haga, Toru Kimura, Akira Yamada, Hiroshi Yamabuchi, Akihiro Murahashi, Hideo Okayama, Nobuaki Uehara
  • Patent number: 7522422
    Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: April 21, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
  • Publication number: 20090071631
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Application
    Filed: November 20, 2008
    Publication date: March 19, 2009
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Publication number: 20080223556
    Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.
    Type: Application
    Filed: May 21, 2008
    Publication date: September 18, 2008
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
  • Patent number: 7380584
    Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: June 3, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
  • Publication number: 20070211434
    Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).
    Type: Application
    Filed: May 11, 2007
    Publication date: September 13, 2007
    Inventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
  • Patent number: 7254030
    Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: August 7, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
  • Publication number: 20070089861
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Application
    Filed: November 22, 2006
    Publication date: April 26, 2007
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
  • Patent number: 7201215
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: April 10, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
  • Publication number: 20070074854
    Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.
    Type: Application
    Filed: November 22, 2006
    Publication date: April 5, 2007
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
  • Publication number: 20070046112
    Abstract: A large number of ventilating apertures that have a circular cross section are disposed through the heatsink so as to extend from an air intake apertured surface to an air discharge apertured surface so as to have aperture directions that are parallel to each other and parallel to an element mount surface, and the heatsink is disposed such that the air intake apertured surface faces an air intake aperture and the aperture directions of the ventilating apertures are aligned in a direction of flow of a cooling airflow.
    Type: Application
    Filed: August 17, 2006
    Publication date: March 1, 2007
    Inventors: Nobuaki Uehara, Tetsuro Ogushi, Yoshihito Asao, Hitoshi Isoda
  • Patent number: 6983790
    Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: January 10, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Kazushige Nakao, Hiroaki Ishikawa, Toshiyuki Umemoto, Hiroshi Chiba, Mihoko Shimoji