Patents by Inventor Tetsuro Ogushi
Tetsuro Ogushi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8371367Abstract: A heat sink includes a base having a first surface thermally connected to a heat producing component and a plurality of fins supported by a second surface of the base and arranged in a predetermined direction, each fin having a plurality of through-holes. The base and the plurality of fins are integrally formed from a porous material, for example a lotus-shaped porous material. The heat sink is placed within a duct. The heat sink may have a width of about 10 mm or less.Type: GrantFiled: August 11, 2005Date of Patent: February 12, 2013Assignees: Mitsubishi Denki Kabushiki Kaisha, Osaka UniversityInventors: Hiroshi Chiba, Tetsuro Ogushi, Hideo Nakajima
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Patent number: 7960874Abstract: A cooling device of a linear motor to cool a primary side of the linear motor including an iron core and a coil accommodated in slots of the iron core, including an elongate cover covering coil end portions exposed from both side faces of the iron core in a longitudinal direction, an air channel serving as blower for forcing a current of cooling air inside the cover, and a partition plate dividing the inside of the cover into upper and lower spaces. It is configured in such a manner that the upper space divided by the partition plate is used as a ventilation portion through which a current of cooling air is forced and the lower space is used as a cooling portion in which the coil end portions are accommodated and cooled. A slit is formed almost along a full length of the partition plate on a side closer to the iron core for bringing the ventilation portion and the cooling portion into communication with each other, and a vent is provided in a lower portion of the cooling portion.Type: GrantFiled: December 21, 2006Date of Patent: June 14, 2011Assignee: Mitsubishi Electric CorporationInventors: Haruhiro Oda, Toshinori Nakagawa, Tetsuro Ogushi
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Patent number: 7841387Abstract: A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route.Type: GrantFiled: May 21, 2008Date of Patent: November 30, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
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Patent number: 7810551Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 20, 2008Date of Patent: October 12, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20100139904Abstract: A heat sink (2) has a base (4) having a first surface (4a) thermally connected to a heat producing body and also has fins (6a-6d) each having through-holes (8), the fins being supported by a second surface (4b) of the base (4) and arranged in a predetermined direction. The base (4) and the fins (6a-6d) are integrally formed of a porous material (lotus-type porous material). The heat sink (2) is placed in a duct (80). It is preferable that the width (W) of the heat sink (2) is substantially equal to or less than 10 mm.Type: ApplicationFiled: August 11, 2005Publication date: June 10, 2010Applicant: Osaka UniversityInventors: Hiroshi Chiba, Tetsuro Ogushi, Hideo Nakajima
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Patent number: 7721793Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 22, 2006Date of Patent: May 25, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20100066179Abstract: A cooling device of a linear motor to cool a primary side of the linear motor including an iron core and a coil accommodated in slots of the iron core, including an elongate cover covering coil end portions exposed from both side faces of the iron core in a longitudinal direction, an air channel serving as blower for forcing a current of cooling air inside the cover, and a partition plate dividing the inside of the cover into upper and lower spaces. It is configured in such a manner that the upper space divided by the partition plate is used as a ventilation portion through which a current of cooling air is forced and the lower space is used as a cooling portion in which the coil end portions are accommodated and cooled. A slit is formed almost along a full length of the partition plate on a side closer to the iron core for bringing the ventilation portion and the cooling portion into communication with each other, and a vent is provided in a lower portion of the cooling portion.Type: ApplicationFiled: December 21, 2006Publication date: March 18, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Haruhiro Oda, Toshinori Nakagawa, Tetsuro Ogushi
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Patent number: 7545642Abstract: A large number of ventilating apertures that have a circular cross section are disposed through the heatsink so as to extend from an air intake apertured surface to an air discharge apertured surface so as to have aperture directions that are parallel to each other and parallel to an element mount surface, and the heatsink is disposed such that the air intake apertured surface faces an air intake aperture and the aperture directions of the ventilating apertures are aligned in a direction of flow of a cooling airflow.Type: GrantFiled: August 17, 2006Date of Patent: June 9, 2009Assignee: Mitsubishi Electric CorporationInventors: Nobuaki Uehara, Tetsuro Ogushi, Yoshihito Asao, Hitoshi Isoda
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Publication number: 20090114372Abstract: A heat sink includes a heat-transfer container incorporating a flow path through which a cooling fluid flows, for cooling a heating element in contact with the heat-transfer container The flow path includes a first cross-sectional portion that becomes narrower as the distance between a given point in the flow path and a side of the heat-transfer container which makes contact with the heating element becomes longer in a direction perpendicular to the direction in which the cooling fluid flows, and a second cross-sectional portion that is approximately constant in the direction perpendicular to the direction in which the cooling fluid flows. The first cross-sectional portion and the second cross-sectional portion alternately continue in the direction in which the cooling fluid flows causing a three-dimensional flow so the heat-transfer properties are enhanced with a simplified structure.Type: ApplicationFiled: September 13, 2005Publication date: May 7, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Seiji Haga, Toru Kimura, Akira Yamada, Hiroshi Yamabuchi, Akihiro Murahashi, Hideo Okayama, Nobuaki Uehara
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Patent number: 7522422Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).Type: GrantFiled: May 11, 2007Date of Patent: April 21, 2009Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
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Publication number: 20090071631Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 20, 2008Publication date: March 19, 2009Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20080223556Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.Type: ApplicationFiled: May 21, 2008Publication date: September 18, 2008Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
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Patent number: 7380584Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.Type: GrantFiled: December 10, 2004Date of Patent: June 3, 2008Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi
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Publication number: 20070211434Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).Type: ApplicationFiled: May 11, 2007Publication date: September 13, 2007Inventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
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Patent number: 7254030Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).Type: GrantFiled: June 15, 2004Date of Patent: August 7, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hiroshi Chiba, Tetsuro Ogushi, Akira Yamada, Hiroshi Yamabuchi
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Publication number: 20070089861Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 22, 2006Publication date: April 26, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
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Patent number: 7201215Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: January 13, 2004Date of Patent: April 10, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20070074854Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 22, 2006Publication date: April 5, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
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Publication number: 20070046112Abstract: A large number of ventilating apertures that have a circular cross section are disposed through the heatsink so as to extend from an air intake apertured surface to an air discharge apertured surface so as to have aperture directions that are parallel to each other and parallel to an element mount surface, and the heatsink is disposed such that the air intake apertured surface faces an air intake aperture and the aperture directions of the ventilating apertures are aligned in a direction of flow of a cooling airflow.Type: ApplicationFiled: August 17, 2006Publication date: March 1, 2007Inventors: Nobuaki Uehara, Tetsuro Ogushi, Yoshihito Asao, Hitoshi Isoda
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Patent number: 6983790Abstract: A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.Type: GrantFiled: July 15, 2003Date of Patent: January 10, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Tetsuro Ogushi, Kazushige Nakao, Hiroaki Ishikawa, Toshiyuki Umemoto, Hiroshi Chiba, Mihoko Shimoji