Patents by Inventor Tetsuro Sasaki

Tetsuro Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200211998
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Shou MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10697189
    Abstract: A connector for temporary scaffolding at an end of a lateral member, to be wedge-connected to a receiver around a strut, includes: a wedge body provided movably at the end of the lateral member upward and downward relative to the lateral member; a locking body including a claw formed such that, as a result of the wedge-body's moving downward, the claw could travel from initial to locking position with respect to the receiver; and a biasing body capable of pressing the locking body toward the wedge body, wherein the wedge body includes a shoulder protruding toward the locking body, the locking body includes an interfering portion protruding toward the wedge body, and when the claw is at the initial position, the shoulder is blocked by the interfering portion from moving upward, thereby preventing the wedge body from moving upward and the locking body from traveling toward the biasing body.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: June 30, 2020
    Assignee: NIKKEN LEASE KOGYO CO., LTD.
    Inventors: Tadakatsu Sekiyama, Tetsuro Okada, Sohei Wada, Masaki Ito, Hirofumi Sasaki, Shinobu Sato, Hazuki Shinohara
  • Publication number: 20200180318
    Abstract: A liquid cartridge includes: a cartridge casing having a liquid storage chamber; a first wall; a second wall; and an air communication passage. The first wall is positioned upward relative to the liquid storage chamber. The second wall is positioned upward relative to the first wall. The air communication passage has a first communication hole in communication with the liquid storage chamber and a communication opening open to an atmosphere. The air communication passage includes: an air chamber defined by the first wall and the second wall and in communication with the liquid storage chamber through the first communication hole; a second communication hole formed in the second wall; and a labyrinth path. The labyrinth path is positioned upward relative to the air chamber, and has one end in communication with the second communication hole and another end in communication with the communication opening.
    Type: Application
    Filed: November 13, 2019
    Publication date: June 11, 2020
    Applicant: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Tetsuro KOBAYASHI, Hiroaki TAKAHASHI, Takahiro MIYAO, Fumio NAKAZAWA, Naoya OKAZAKI, Akihito ONO, Kosuke NUKUI, Hiroshi TAIRA, Toyonori SASAKI
  • Publication number: 20200163164
    Abstract: A heater member (1a) includes a support (10), a heating element (20), and at least one pair of power supply electrodes (30). The support (10) is made of an organic polymer and has a sheet shape. The heating element (20) is made of a polycrystalline material containing indium oxide as a main component and in contact with one principal surface of the support (10). The power supply electrodes (30) are in contact with one principal surface of the heating element (20). The heating element (20) has a sheet resistance in the range from 10 to 150 ?/sq. The heating element (20) has a thickness of more than 20 nm and not more than 200 nm. The internal stress of the heating element (20) as measured by an X-ray stress measurement method is 500 MPa or less.
    Type: Application
    Filed: August 3, 2018
    Publication date: May 21, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshihiro Tsurusawa, Hironobu Machinaga, Rie Hayashiuchi, Tetsuro Hori, Shu Sasaki
  • Patent number: 10583824
    Abstract: A vehicle includes a left clutch provided on a path for transmitting driving torque to a left rear wheel and a right clutch provided on a path for transmitting driving torque to a right rear wheel torque. If a command value of the driving torque distributed to the left rear wheel using the left clutch and a command value of the driving torque distributed to the left rear wheel using the right clutch fall respectively below predetermined lower limit values, a control device controls the command values of the driving torque to be predetermined lower limit values. While realizing an optimal torque distribution control, accuracy of the driving torque distributed to the left and right rear wheels (auxiliary drive wheels) can be improved by preventing the command values (command torque) distributed to the left and right rear wheels from becoming small below the limit.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: March 10, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hitoshi Sasaki, Tetsuro Hara
  • Publication number: 20200051941
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
    Type: Application
    Filed: July 15, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuki FUKUDA
  • Publication number: 20200051942
    Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
    Type: Application
    Filed: July 16, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuki FUKUDA
  • Publication number: 20200051943
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10493765
    Abstract: A liquid cartridge includes: a cartridge casing having a liquid storage chamber; a first wall; a second wall; and an air communication passage. The first wall is positioned upward relative to the liquid storage chamber. The second wall is positioned upward relative to the first wall. The air communication passage has a first communication hole in communication with the liquid storage chamber and a communication opening open to an atmosphere. The air communication passage includes: an air chamber defined by the first wall and the second wall and in communication with the liquid storage chamber through the first communication hole; a second communication hole formed in the second wall; and a labyrinth path. The labyrinth path is positioned upward relative to the air chamber, and has one end in communication with the second communication hole and another end in communication with the communication opening.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: December 3, 2019
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Tetsuro Kobayashi, Hiroaki Takahashi, Takahiro Miyao, Fumio Nakazawa, Naoya Okazaki, Akihito Ono, Kosuke Nukui, Hiroshi Taira, Toyonori Sasaki
  • Publication number: 20190345725
    Abstract: A connector for temporary scaffolding at an end of a lateral member, to be wedge-connected to a receiver around a strut, includes: a wedge body provided movably at the end of the lateral member upward and downward relative to the lateral member; a locking body including a claw formed such that, as a result of the wedge-body's moving downward, the claw could travel from initial to locking position with respect to the receiver; and a biasing body capable of pressing the locking body toward the wedge body, wherein the wedge body includes a shoulder protruding toward the locking body, the locking body includes an interfering portion protruding toward the wedge body, and when the claw is at the initial position, the shoulder is blocked by the interfering portion from moving upward, thereby preventing the wedge body from moving upward and the locking body from traveling toward the biasing body.
    Type: Application
    Filed: July 25, 2019
    Publication date: November 14, 2019
    Applicant: NIKKEN LEASE KOGYO CO., LTD.
    Inventors: Tadakatsu SEKIYAMA, Tetsuro OKADA, Sohei WADA, Masaki ITO, Hirofumi SASAKI, Shinobu SATO, Hazuki SHINOHARA
  • Patent number: 10396641
    Abstract: An object is to easily inject resin into a gap of a laminated core which constitutes a rotating electric machine. Included are: a resin supplying unit which feeds the resin; and a resin injection unit which injects the resin into an axial hole of the laminated core. The resin injection unit has an injection pipe and an elastic ring attached to the injection pipe. This elastic ring is made to firmly attach to the inner periphery of the axial hole; the resin is supplied from the resin supplying unit; and the resin is injected into the gap of the laminated core through the axial hole of the laminated core.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: August 27, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Minoru Aoki, Yoshihide Kikuichi, Tetsuro Yanagi, Yuichiro Sasaki, Koji Mio, Hideaki Shigekiyo
  • Patent number: 10373854
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 6, 2019
    Assignee: Toto Ltd.
    Inventors: Jumpei Uefuji, Hitoshi Sasaki, Kosuke Yamaguchi, Kengo Maehata, Yuichi Yoshii, Tetsuro Itoyama
  • Patent number: 8867168
    Abstract: A magnetic head includes a main pole, a write shield, and a return path section. The write shield includes first and second shield portions located on opposite sides of the main pole in the track width direction. The return path section includes first and second yoke portions located on opposite sides of the main pole in the track width direction. The first yoke portion is connected to the first shield portion. The second yoke portion is connected to the second shield portion. A coil surrounds at least part of the entire outer periphery of the main pole when viewed from a medium facing surface.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: October 21, 2014
    Assignee: TDK Corporation
    Inventors: Norikazu Ota, Masahiro Saito, Taro Oike, Takeo Kagami, Yosuke Antoku, Kenkichi Anagawa, Kenta Hara, Tetsuro Sasaki, Shingo Miyata, Katsuki Kurihara
  • Publication number: 20140160597
    Abstract: A magnetic head includes a main pole, a write shield, and a return path section. The write shield includes first and second shield portions located on opposite sides of the main pole in the track width direction. The return path section includes first and second yoke portions located on opposite sides of the main pole in the track width direction. The first yoke portion is connected to the first shield portion. The second yoke portion is connected to the second shield portion. A coil surrounds at least part of the entire outer periphery of the main pole when viewed from a medium facing surface.
    Type: Application
    Filed: December 7, 2012
    Publication date: June 12, 2014
    Applicant: TDK CORPORATION
    Inventors: Norikazu OTA, Masahiro SAITO, Taro OIKE, Takeo KAGAMI, Yosuke ANTOKU, Kenkichi ANAGAWA, Kenta HARA, Tetsuro SASAKI, Shingo MIYATA, Katsuki KURIHARA
  • Patent number: 8085038
    Abstract: A noise-testing method for a thin-film magnetic head with an MR read head element and a heating unit capable of applying a heat and a stress to the MR read head element, includes a step of applying alternately and discontinuously with each other an electrical power having a first level and an electrical power having a second level higher than the first level to the heating unit, and a step of evaluating the thin-film magnetic head by measuring a noise output or noise outputs obtained from the MR read head element when the electrical power or the electrical powers are applied to the heating unit.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: December 27, 2011
    Assignees: TDK Corporation, SAE Magnectics (H.K.) Ltd.
    Inventors: Takumi Uesugi, Takeo Kagami, Tetsuro Sasaki, Kei Hirata, Masaru Hirose, Chi Man Lee, Kwok Piu Tso
  • Patent number: 7876537
    Abstract: An MR element incorporates a layered structure. The layered structure includes: a spacer layer having a first surface and a second surface that face toward opposite directions; a free layer disposed adjacent to the first surface of the spacer layer and having a direction of magnetization that changes in response to a signal magnetic field; and a pinned layer disposed adjacent to the second surface of the spacer layer and having a fixed direction of magnetization. The spacer layer is a layer at least part of which is made of a material other than a conductor, and the spacer layer intercepts the passage of currents or limits the passage of currents as compared with a layer entirely made of a conductor. The MR element further incorporates a conductive film that is disposed on the peripheral surface of the layered structure and allows conduction between the free layer and the pinned layer.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: January 25, 2011
    Assignee: TDK Corporation
    Inventors: Takumi Uesugi, Tetsuro Sasaki, Takeo Kagami, Kei Hirata
  • Patent number: 7864489
    Abstract: Provided is a thin-film magnetic head in which a noise due to the voltage potential difference between the read head element and the protective coat surface is suppressed. The thin-film magnetic head comprises: a read head element, one end surface of the read head element reaching an head end surface on the ABS side; a protective coat formed on the head end surface in such a way to cover at least the one end surface of the read head element; and at least one antistatic means for preventing the protective coat from being electrostatically charged, formed on/above the element formation surface, one end surface of the at least one antistatic means reaching the head end surface, the protective coat covering a portion, not the whole, of the one end surface of the at least one antistatic means on the head end surface.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: January 4, 2011
    Assignee: TDK Corporation
    Inventors: Kei Hirata, Takeo Kagami, Takumi Uesugi, Tetsuro Sasaki
  • Patent number: 7843667
    Abstract: Provided is a thin film magnetic head capable of suppressing an occurrence of a track erase, decreasing an influence on a magnetoresistive element caused by a magnetic flux generated from a thin film coil, and further decreasing the parasitic capacity. The thin film magnetic head has, in order in a stacked direction, a first magnetic shield layer, a magnetoresistive element, a second magnetic shield layer, a third magnetic shield layer, a main magnetic pole layer and a return yoke layer. A width in a track width direction of at least one of the first and the second magnetic shield layers is smaller than widths in a track width direction of the third magnetic shield layer and the return yoke layer.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: November 30, 2010
    Assignee: TDK Corporation
    Inventors: Kei Hirata, Norikazu Ota, Yuichi Watabe, Tetsuro Sasaki, Takeo Kagami, Tetsuya Roppongi, Kazuki Sato, Yuji Otsubo, Sohei Horiuchi, Yoshiaki Tanaka, Kenji Yokoyama, Noriaki Kasahara
  • Patent number: 7832085
    Abstract: A method of manufacturing a magnetic head includes the steps of: fabricating a substructure in which pre-head portions are aligned in a plurality of rows by forming components of a plurality of magnetic heads on a single substrate; and fabricating the plurality of magnetic heads by separating the pre-head portions from one another through cutting the substructure. In the step of fabricating the substructure, the resistance of an MR film that will be formed into an MR element by undergoing lapping later is detected to determine the target position of the boundary between a track width defining portion and a wide portion of a pole layer based on the resistance detected, and the pole layer is thereby formed. In the step of fabricating the magnetic heads, the surface formed by cutting the substructure is lapped such that the MR film is lapped and the resistance thereof thereby reaches a predetermined value.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: November 16, 2010
    Assignee: TDK Corporation
    Inventors: Takeo Kagami, Tetsuro Sasaki, Yuichi Watabe, Takamitsu Sakamoto
  • Patent number: 7542236
    Abstract: A magnetic head part is constituted by a reproducing head part having a GMR device and a recording head part acting as an inductive electromagnetic transducer which are laminated on a support. The magnetic head part further comprises a heater. One of poles of the heater is electrically connected to a heater electrode pad disposed on a first surface of a head slider. The other pole is electrically connected to a substrate constituting the support, and is energized by way of a second surface of the head slider.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: June 2, 2009
    Assignee: TDK Corporation
    Inventors: Norikazu Ota, Tetsuro Sasaki, Nobuya Oyama, Soji Koide