Patents by Inventor Tetsuro Satoh

Tetsuro Satoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for copper foils and adhesive-backed copper foil
    Patent number: 5707729
    Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: January 13, 1998
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Tetsuro Satoh