Patents by Inventor Tetsuro Yasukawa

Tetsuro Yasukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145309
    Abstract: A stacked wafer to be subjected to singulation by stealth dicing, including a first layer in which a modified region is formable, a concave portion forming a space facing the first layer, a second layer that faces the concave portion and in which the modified region is not formed, and a third layer that faces the second layer and in which the modified region is formable, and a part of the second layer facing the concave portion is removed.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: TETSURO YASUKAWA, TAKESHI SHIBATA, MASATAKA KATO
  • Publication number: 20240145310
    Abstract: One embodiment of the present disclosure is a stealth dicing method performed on a wafer having a first substrate, a second substrate, and a hollow portion, the second substrate being thinner than the first substrate in a region defining the hollow portion. The stealth dicing method has a first step of performing laser application on the second substrate to form a modified region in the second substrate and a second step of performing laser application on the first substrate after the first step to form a modified region in the first substrate. In either the first or second step, multiple modified regions are formed, arranged in the Z-direction at positions corresponding to both sides of the hollow portion in the Y-direction, and in the other step, multiple modified regions are formed, arranged in the Z-direction at a position corresponding to one side of the hollow portion in the Y-direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: TAKASHI TERAGAKI, TETSURO YASUKAWA
  • Publication number: 20230154890
    Abstract: A dicing method including the steps of: bonding a first wafer having a first wafer resistivity and a second wafer having a second wafer resistivity higher than the wafer first resistivity, thereby forming a bonded wafer; irradiating the bonded wafer with a laser while varying focal lengths in a thickness direction of the bonded wafer, thereby forming a plurality of modified regions along a dicing line; and dicing the bonded wafer along the dicing line by performing an expansion process on the bonded wafer formed with the modified regions.
    Type: Application
    Filed: October 25, 2022
    Publication date: May 18, 2023
    Inventors: Tetsuro Yasukawa, Takeshi Shibata
  • Patent number: 9270864
    Abstract: To provide a color mixing inspection method, a color mixing inspection apparatus and a print apparatus capable of carrying out a color mixing inspection at low cost for the inspection with high detection ability. To that end, an evaluation pattern is irradiated with light having a color complementary to color mixed into the evaluation pattern to emphasize the color mixing and measure lightness, thereby determining the presence of color mixing.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: February 23, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hiroyuki Wada, Tetsuro Yasukawa
  • Patent number: 9266346
    Abstract: An ink color mixing in an inkjet printing head can be securely detected without being influenced by foreign matters such as the existence of dust and without requiring a complicated image processing. To realize this, the occurrence of a color mixing is detected when a printing density-changed part of a printed image of an inspection pattern continuously extends over a predetermined range or more in a direction in which the printing head is moved relative to the printing medium during the printing of the inspection pattern.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: February 23, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Tetsuro Yasukawa
  • Patent number: 9079417
    Abstract: In the regions in the check pattern image where the stripe is formed, the density of the region with higher density has a density value lower than the density value in the case without occurrence of the color mixing and the density of the region with lower density has a density value higher than the density value in the case without occurrence of the color mixing. Regarding this difference in the density value, determination on whether or not density unevenness caused by the color mixing or the landing position deviation occurs is made by using a threshold value and a threshold value different from that.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: July 14, 2015
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Tetsuro Yasukawa
  • Publication number: 20150062234
    Abstract: To provide a color mixing inspection method, a color mixing inspection apparatus and a print apparatus capable of carrying out a color mixing inspection at low cost for the inspection with high detection ability. To that end, an evaluation pattern is irradiated with light having a color complementary to color mixed into the evaluation pattern to emphasize the color mixing and measure lightness, thereby determining the presence of color mixing.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 5, 2015
    Inventors: Hiroyuki Wada, Tetsuro Yasukawa
  • Publication number: 20150062208
    Abstract: An ink color mixing in an inkjet printing head can be securely detected without being influenced by foreign matters such as the existence of dust and without requiring a complicated image processing. To realize this, the occurrence of a color mixing is detected when a printing density-changed part of a printed image of an inspection pattern continuously extends over a predetermined range or more in a direction in which the printing head is moved relative to the printing medium during the printing of the inspection pattern.
    Type: Application
    Filed: August 26, 2014
    Publication date: March 5, 2015
    Inventor: Tetsuro Yasukawa