Patents by Inventor Tetsurou Abumita

Tetsurou Abumita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component storing package and electronic apparatus
    Patent number: 8242387
    Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: August 14, 2012
    Assignees: Kyocera Corporation, FJ Composite Materials Co., Ltd.
    Inventors: Atsurou Yoneda, Tetsurou Abumita, Yoshiaki Ueda, Eiki Tsushima
  • Composite ceramic body
    Patent number: 7943241
    Abstract: A composite ceramic body and a method thereof are provided. The composite ceramic body comprising a first bonding body comprising a ceramic containing Si ingredient, and a second bonding body bonded to the first bonding body through a bonding material containing, as main ingredient, a Si compound which includes the element common to the Si ingredient contained in the first bonding body. The first and second bonding bodies can be bonded strongly and uniformly without any adhesive. Since the composite ceramic body has high bonding strength, it is applicable to microchemical chips and reformers.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: May 17, 2011
    Assignee: Kyocera Corporation
    Inventors: Junji Kurokawa, Kazutsugu Kobayashi, Motoaki Yoshida, Masahiro Okumura, Atsushi Ogasawara, Tetsurou Abumita, Takeshi Ogawa, Masakazu Yasui
  • Electronic Component Storing Package and Electronic Apparatus
    Publication number: 20100059271
    Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.
    Type: Application
    Filed: July 27, 2007
    Publication date: March 11, 2010
    Applicants: KYOCERA CORPORATION, FJ COMPOSITE MATERIALS CO., LTD.
    Inventors: Atsurou Yoneda, Tetsurou Abumita, Yoshiaki Ueda, Eiki Tsushima
  • Composite Ceramic Body and Manufacturing Method Thereof, Microchemical Chip, and Reformer
    Publication number: 20080305005
    Abstract: A composite ceramic body and a method thereof are provided. The composite ceramic body comprising a first bonding body comprising a ceramic containing Si ingredient, and a second bonding body bonded to the first bonding body through a bonding material containing, as main ingredient, a Si compound which includes the element common to the Si ingredient contained in the first bonding body. The first and second bonding bodies can be bonded strongly and uniformly without any adhesive. Since the composite ceramic body has high bonding strength, it is applicable to microchemical chips and reformers.
    Type: Application
    Filed: November 29, 2005
    Publication date: December 11, 2008
    Applicant: Kyocera Corporation
    Inventors: Junji Kurokawa, Kazutsugu Kobayashi, Motoaki Yoshida, Masahiro Okumura, Atsushi Ogasawara, Tetsurou Abumita, Takeshi Ogawa, Masakazu Yasui