Patents by Inventor Tetsurou ASHIDA

Tetsurou ASHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072741
    Abstract: A smaller size is achieved by reducing a circuit size and the characteristics of all bands are made satisfactory. A radio-frequency module transmits and receives transmission/reception signals in a first frequency band and transmission/reception signals in a second frequency band lower than the first frequency band by time division duplex communication. A switch allows an output from a filter to be input to a low-noise amplifier upon reception of a signal in the second frequency band and allows an output from a power amplifier to be input to the filter upon transmission of a signal in the second frequency band to thereby share the filter for transmission/reception signals in the second frequency band.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 29, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tetsurou ASHIDA
  • Patent number: 11689173
    Abstract: A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: June 27, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuhiro Takahashi, Tetsurou Ashida
  • Publication number: 20200389144
    Abstract: A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 10, 2020
    Inventors: Kazuhiro TAKAHASHI, Tetsurou ASHIDA