Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Abstract: A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Abstract: A method for manufacturing multi-kind and small-quantity semiconductor products in a mass-production line and a system thereof are provided. In the method for manufacturing a semiconductor device through a plurality of fabrication processing steps, each of the chips on a wafer is controlled based on a chip identification information formed on a wafer. The method includes the step of editing the chip identification information such that the chip identification information for chips having the same fabrication processing steps and chips formed on the same wafer can be read out successively. The method also includes the step of carrying out each of the fabrication processing steps based on the chip identification information formed on the wafer by reading out the chip identification information.

Abstract: A method for manufacturing multi-kind and small-quantity semiconductor products in a mass-production line and a system thereof are provided. One aspect of the present invention, there is provided the method for manufacturing a semiconductor device through a plurality of fabrication processing steps, each of the fabrication processing steps being carried out sequentially with a plurality of chips on a wafer based on a chip identification information formed on the wafer, the method comprises at least two steps sharing the chip identification information before at least one of the two steps is carried out, wherein the steps are not immediately neighbored with each other in fabrication processing sequence.

Abstract: A method for manufacturing multi-kind and small-quantity semiconductor products in a mass-production line and a system thereof are provided. One aspect of the present invention, there is provided the method for manufacturing a semiconductor device through a plurality of fabrication processing steps, each of the fabrication processing steps being carried out sequentially with a plurality of chips on a wafer based on a chip identification information formed on the wafer, the method comprises at least two steps sharing the chip identification information before at least one of the two steps is carried out, wherein the steps are not immediately neighbored with each other in fabrication processing sequence.

Abstract: A method for manufacturing multi-kind and small-quantity semiconductor products in a mass-production line and a system thereof are provided. One aspect of the present invention, there is provided the method for manufacturing a semiconductor device through a plurality of fabrication processing steps, each of the fabrication processing steps being carried out sequentially with a plurality of chips on a wafer based on a chip identification information formed on the wafer, the method comprises at least two steps sharing the chip identification information before at least one of the two steps is carried out, wherein the steps are not immediately neighbored with each other in fabrication processing sequence.