Patents by Inventor Tetsurou Imura

Tetsurou Imura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9139687
    Abstract: An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: September 22, 2015
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takayoshi Hirai, Tetsurou Imura, Makoto Takahashi
  • Publication number: 20120043508
    Abstract: An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.
    Type: Application
    Filed: August 27, 2009
    Publication date: February 23, 2012
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Takayoshi Hirai, Tetsurou Imura, Makoto Takahashi