Patents by Inventor Tetsurou Okada

Tetsurou Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-copper alloy electroplating bath
    Patent number: 6508927
    Abstract: A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: January 21, 2003
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Masanobu Tsujimoto, Tetsurou Okada, Teruya Oka, Hideyuki Tsubokura
  • TIN - COPPER ALLOY ELECTROPLATING BATH AND PLATING PROCESS THEREWITH
    Publication number: 20020104763
    Abstract: A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
    Type: Application
    Filed: November 4, 1999
    Publication date: August 8, 2002
    Inventors: ISAMU YANADA, MASANOBU TSUJIMOTO, TETSUROU OKADA, TERUYA OKA, HIDEYUKI TSUBOKURA