Patents by Inventor Tetsurou Satoh

Tetsurou Satoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
    Patent number: 6187416
    Abstract: There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: February 13, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsurou Satoh, Tsutomu Asai
  • Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
    Patent number: 6165617
    Abstract: A resin-coated copper foil for use in a multilayer printed wiring board, characterized by having on one surface thereof a resin composition comprising, based on the total amount of the resin components, 50 to 90% by weight of epoxy resins, 5 to 20% by weight of a polyvinyl acetal resin, and 0.1 to 20% by weight of an urethane resin, with the proviso that 0.5 to 40% by weight of the epoxy resins is a rubber-modified epoxy resin; and a multilayer printed wiring board using the resin-coated copper foil therein.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: December 26, 2000
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsurou Satoh, Hiroaki Tsuyoshi, Nobuo Hayasaka