Abstract: A semiconductor integrated circuit device includes cells A-1, B-1, and C-1 that have the same logic. Cell B-1 has cell width W2 larger than a cell width of cell A-1, but gate length L1 of a MOS transistor is equal to that of cell A-1. Cell C-1 has cell width W2 equal to a cell width of cell B-1, but has a MOS transistor having large gate length L2. A circuit delay of cell C-1 becomes large as compared with that of cells A-1 and B-1, but leak current becomes small. Therefore, by replacing cell A-1 adjacent to a space area with cell B-1, and by replacing cell B-1 in a path having room in timing with cell C-1, for example, leak current can be suppressed without increasing a chip area.

Abstract: A semiconductor integrated circuit device includes cells A-1, B-1, and C-1 that have the same logic. Cell B-1 has cell width W2 larger than a cell width of cell A-1, but gate length L1 of a MOS transistor is equal to that of cell A-1. Cell C-1 has cell width W2 equal to a cell width of cell B-1, but has a MOS transistor having large gate length L2. A circuit delay of cell C-1 becomes large as compared with that of cells A-1 and B-1, but leak current becomes small. Therefore, by replacing cell A-1 adjacent to a space area with cell B-1, and by replacing cell B-1 in a path having room in timing with cell C-1, for example, leak current can be suppressed without increasing a chip area.

Abstract: A semiconductor integrated circuit includes a first transistor which is formed of a first gate extending in a first direction and a first diffusion region and which is capable of being active, a second transistor which is formed of a second gate extending in the first direction and a second diffusion region and which is arranged adjacent to the first transistor in a second direction intersected at a right angle with the first direction, and a third gate which extends in the first direction and which is arranged adjacent in the second direction to the first transistor on an opposite side to the second transistor. A space between the first gate and the second gate is larger than a space between the first gate and the third gate.

Abstract: In a layout structure capable of independent supply of a substrate or well potential from a power supply potential, further reduction in layout area is achieved. A reinforcing power supply cell is inserted in a cell line in which a plurality of cells are arranged in series. Each of the cells includes an impurity doped region for supplying a substrate or well potential NWVDD which is different from a positive power supply potential VDD to a p-type transistor arranging region. The reinforcing power supply cell includes a power supply impurity doped region to which an impurity doped region of an adjacent cell is electrically connected and a power supply wire provided in a wiring layer formed above the power supply impurity doped region and electrically connected to the power supply impurity doped region.

Abstract: There is provided a layout structure of a semiconductor integrated circuit capable of preventing the thinning of a metal wiring line close to a cell boundary and wire breakage therein without involving increases in the amount of data for OPC correction and OPC process time. In a region interposed between a power supply line and a ground line each placed to extend in a first direction, first and second cells each having a transistor and an intra-cell line each for implementing a circuit function are placed to be adjacent to each other in the first direction. In a boundary portion between the first and second cells, a metal wiring line extending in a second direction orthogonal to the first direction is placed so as not to short-circuit the power supply line and the ground line.

Abstract: There is provided a layout structure of a semiconductor integrated circuit capable of preventing the thinning of a metal wiring line close to a cell boundary and wire breakage therein without involving increases in the amount of data for OPC correction and OPC process time. In a region interposed between a power supply line and a ground line each placed to extend in a first direction, first and second cells each having a transistor and an intra-cell line each for implementing a circuit function are placed to be adjacent to each other in the first direction. In a boundary portion between the first and second cells, a metal wiring line extending in a second direction orthogonal to the first direction is placed so as not to short-circuit the power supply line and the ground line.

Abstract: A semiconductor integrated circuit includes a first transistor which is formed of a first gate extending in a first direction and a first diffusion region and which is capable of being active, a second transistor which is formed of a second gate extending in the first direction and a second diffusion region and which is arranged adjacent to the first transistor in a second direction intersected at a right angle with the first direction, and a third gate which extends in the first direction and which is arranged adjacent in the second direction to the first transistor on an opposite side to the second transistor. A space between the first gate and the second gate is larger than a space between the first gate and the third gate.

Abstract: A semiconductor integrated circuit includes a first transistor which is formed of a first gate extending in a first direction and a first diffusion region and which is capable of being active, a second transistor which is formed of a second gate extending in the first direction and a second diffusion region and which is arranged adjacent to the first transistor in a second direction intersected at a right angle with the first direction, and a third gate which extends in the first direction and which is arranged adjacent in the second direction to the first transistor on an opposite side to the second transistor. A space between the first gate and the second gate is larger than a space between the first gate and the third gate.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: In a layout structure capable of independent supply of a substrate or well potential from a power supply potential, further reduction in layout area is achieved. A reinforcing power supply cell is inserted in a cell line in which a plurality of cells are arranged in series. Each of the cells includes an impurity doped region for supplying a substrate or well potential NWVDD which is different from a positive power supply potential VDD to a p-type transistor arranging region. The reinforcing power supply cell includes a power supply impurity doped region to which an impurity doped region of an adjacent cell is electrically connected and a power supply wire provided in a wiring layer formed above the power supply impurity doped region and electrically connected to the power supply impurity doped region.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A semiconductor integrated circuit includes a first transistor which is formed of a first gate extending in a first direction and a first diffusion region and which is capable of being active, a second transistor which is formed of a second gate extending in the first direction and a second diffusion region and which is arranged adjacent to the first transistor in a second direction intersected at a right angle with the first direction, and a third gate which extends in the first direction and which is arranged adjacent in the second direction to the first transistor on an opposite side to the second transistor. A space between the first gate and the second gate is larger than a space between the first gate and the third gate.

Abstract: A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area.

Abstract: A dummy MOSFET including a dummy gate separates nMOSFETs included in adjacent memory cells arranged in the direction in which bit lines extend. This configuration reduces a stress applied from an STI to the channel regions of the nMOSFETs. Accordingly, decrease of drive currents of the nMOSFETs is suppressed.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A signal is transmitted in synchronization with a clock signal that repeats H and L levels indicating a preparation period and a transmission period, respectively. A transmitting circuit includes a transmitting capacitor, an input switch for setting a voltage in accordance with an input digital signal in the transmitting capacitor at preparation period, and a transmitting switch for generating a small voltage change in the signal line at transmission period, the voltage change being in accordance with a voltage of the transmitting capacitor.

Abstract: A delay library of high accuracy is efficiently generated within a short time period. To this end, a set-up time is calculated by static analysis with no consideration of a delay caused by a wire; the initial value of the search range for the next binary search cycle is set such that the set-up time is the median value of the search range (for example, the range of 0.5 ns is set); and correct set-up time ? is obtained using binary search based on the initial value of the search range.

Abstract: A dummy MOSFET including a dummy gate separates nMOSFETs included in adjacent memory cells arranged in the direction in which bit lines extend. This configuration reduces a stress applied from an STI to the channel regions of the nMOSFETs. Accordingly, decrease of drive currents of the nMOSFETs is suppressed.