Abstract: A sputter target for producing electroconductive transparent films, which comprises indium oxide and tin oxide and having a shape such that not less than 80% by weight of the target is present in an erosion area on sputtering, and a process for manufacturing the sputtering target which comprises molding a slurry or a powder mixture containing indium oxide and tin oxide into a molded shape and sintering the molded shape are disclosed.

Abstract: An indium oxide powder or indium oxide/tin oxide powder having an average primary particle diameter of 1 to 0.01 .mu.m, a BET surface area of 15 to 50 m.sup.2 /g, and a specific surface area of 2 to 5 m.sup.2 /g as determined from the particle diameter distribution. The mixed powder is prepared by coprecipitating an indium- and tin-containing salt from a solution containing indium and tin, calcining the salt, and pulverizing the calcined product using a specific vibrating pulverizer. A sintered body, prepared by sintering the indium oxide/tin oxide powder, has a density of at least 5.3 g/cm.sup.3, a specific resistance of 2.times.10.sup.-3 to 2.times.10.sup.-4 .OMEGA.-cm, and an average grain diameter of 5 to 15 .mu.m.