Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that supplies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; and the coating liquid collector provided with a plurality of openings through which an exhaust flow passes, the coating liquid collector extending downward below the downwardly-extending wall of the inner cup with a gap between the coating liquid collector and a lower end of the downwardly-extending wall.

Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that applies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; a cylindrical wall portion provided below the inner cup and having an upwardly-opened exhaust port communicating with the exhaust path; and the coating liquid collector arranged below the wall of the inner cup with a gap between the coating liquid collector and a lower end of the wall.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.

Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.

Abstract: There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.