Patents by Inventor Tetsushi Morikawa

Tetsushi Morikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230114048
    Abstract: A relay hermetic terminal characterized by including: a metal container having a through hole; a pipe lead inserted through the through hole; an insulating material sealing the metal container and the pipe lead; and a terminal block made of a low-resistance metal, penetrating the pipe lead and secured to the pipe lead. The terminal block includes at least a body portion and a head portion, further the head portion has a fixation portion, and an axis of the fixation portion is not arranged coaxially with an axis of the body portion, and a relay contact device using the same are provided.
    Type: Application
    Filed: March 17, 2021
    Publication date: April 13, 2023
    Applicant: Schott Japan Corporation
    Inventors: Ko MAMIYA, Tetsushi MORIKAWA
  • Publication number: 20220381397
    Abstract: There is provided a mounting tool for an elevator rope tension measurement device, the mounting tool being capable of preventing the rope tension measurement device from interfering with a rope disposed adjacently to a rope that is a measurement target. A mounting tool for an elevator rope tension measurement device includes: a first holding body configured to hold a rope of an elevator; a second holding body configured to hold a rope tension measurement device that measures a tension of the rope; and a connecting body configured to connect the first holding body with the second holding body so as to dispose the rope tension measurement device at a position away from the rope.
    Type: Application
    Filed: July 3, 2020
    Publication date: December 1, 2022
    Applicants: Mitsubishi Electric Building Techno-Service Co., Ltd., Mitsubishi Electric Corporation
    Inventors: Kotaro WATANABE, Tetsuro SEKI, Sunao FUJIWARA, Yoshiko ONO, Tetsushi MORIKAWA, Takuya HASHIGUCHI, Hiroshi FUKUNAGA, Yasuyuki KOIDE
  • Publication number: 20220230787
    Abstract: A hermetic terminal includes a metal outer ring made of a low resistance conductor having a through hole, a lead made of a low resistance conductor inserted in the through hole of the metal outer ring, and an insulating material made of high expansion glass for sealing the metal outer ring and the lead.
    Type: Application
    Filed: July 14, 2020
    Publication date: July 21, 2022
    Inventors: Makoto TANAKA, Hiroshi KATO, Tetsushi MORIKAWA, Akira OKUNO
  • Patent number: 10834835
    Abstract: A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: November 10, 2020
    Assignee: SCHOTT Japan Corporation
    Inventors: Akira Okuno, Tetsushi Morikawa
  • Patent number: 10580602
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 3, 2020
    Assignee: SCHOTT Japan Corporation
    Inventors: Tetsushi Morikawa, Akira Okuno, Susumu Nishiwaki, Yutaka Onezawa
  • Patent number: 10468801
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring; and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 5, 2019
    Assignee: SCHOTT Japan Corporation
    Inventors: Akira Okuno, Tetsushi Morikawa, Tarou Hirai, Kazuhito Miyawaki, Masahiro Taketomi, Yoshinaga Hamaguchi
  • Publication number: 20190313539
    Abstract: A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.
    Type: Application
    Filed: June 20, 2017
    Publication date: October 10, 2019
    Inventors: Akira OKUNO, Tetsushi MORIKAWA
  • Publication number: 20190036255
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring, and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Application
    Filed: August 8, 2017
    Publication date: January 31, 2019
    Inventors: Akira OKUNO, Tetsushi MORIKAWA, Tarou HIRAI, Kazuhito MIYAWAKI, Masahiro TAKETOMI, Yoshinaga HAMAGUCHI
  • Publication number: 20180286614
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Application
    Filed: September 29, 2016
    Publication date: October 4, 2018
    Inventors: Tetsushi MORIKAWA, Akira OKUNO, Susumu NISHIWAKI, Yutaka ONEZAWA
  • Patent number: 8908728
    Abstract: A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 9, 2014
    Assignee: Schott AG
    Inventors: George Lin Huikai, Amy Soon Li Ping, Tetsushi Morikawa, Rohit Bhosale, Shaifullah Bin Mohamed Kamari