Patents by Inventor Tetsushi Morikawa

Tetsushi Morikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10834835
    Abstract: A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: November 10, 2020
    Assignee: SCHOTT Japan Corporation
    Inventors: Akira Okuno, Tetsushi Morikawa
  • Patent number: 10580602
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 3, 2020
    Assignee: SCHOTT Japan Corporation
    Inventors: Tetsushi Morikawa, Akira Okuno, Susumu Nishiwaki, Yutaka Onezawa
  • Patent number: 10468801
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring; and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 5, 2019
    Assignee: SCHOTT Japan Corporation
    Inventors: Akira Okuno, Tetsushi Morikawa, Tarou Hirai, Kazuhito Miyawaki, Masahiro Taketomi, Yoshinaga Hamaguchi
  • Publication number: 20190313539
    Abstract: A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.
    Type: Application
    Filed: June 20, 2017
    Publication date: October 10, 2019
    Inventors: Akira OKUNO, Tetsushi MORIKAWA
  • Publication number: 20190036255
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring, and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Application
    Filed: August 8, 2017
    Publication date: January 31, 2019
    Inventors: Akira OKUNO, Tetsushi MORIKAWA, Tarou HIRAI, Kazuhito MIYAWAKI, Masahiro TAKETOMI, Yoshinaga HAMAGUCHI
  • Publication number: 20180286614
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Application
    Filed: September 29, 2016
    Publication date: October 4, 2018
    Inventors: Tetsushi MORIKAWA, Akira OKUNO, Susumu NISHIWAKI, Yutaka ONEZAWA
  • Patent number: 8908728
    Abstract: A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 9, 2014
    Assignee: Schott AG
    Inventors: George Lin Huikai, Amy Soon Li Ping, Tetsushi Morikawa, Rohit Bhosale, Shaifullah Bin Mohamed Kamari