Abstract: A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured.

Abstract: A solid-state imaging device includes: a housing having a base and a rectangular-frame-shaped rib that are resin molded integrally; metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space, an external terminal portion exposed on a bottom face, and a side electrode portion exposed on an external side face; an imaging element fixed on the base; connection members connecting electrodes of the imaging element and the internal terminal portions of the metal lead pieces, respectively; and a transparent plate fixed on an upper end face of the rib. A thickness of each metal lead piece at a position of its internal terminal portion is substantially equal to a thickness of the base, and the external terminal portion is formed with a reverse face of the metal lead piece at a position corresponding to the internal terminal portion.

Abstract: A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured.

Abstract: An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.