Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Abstract: A power supply device includes a power supply input portion, a rectification portion, a smoothing portion, a power conversion portion, a power supply output portion, a signal input portion, a control portion, a circuit substrate, and a case. The circuit substrate is formed in an elongated rectangular plate-like shape. The power supply input portion is mounted on a first end portion of the circuit substrate in a longitudinal direction. The rectification portion, the smoothing portion, the power conversion portion, the control portion, and the power supply output portion are mounted on the circuit substrate in the stated order from the first end portion toward a second end portion in the longitudinal direction. The signal input portion is mounted at a position closer to the second end portion than the rectification portion in the circuit substrate.

Abstract: A power supply device includes a power supply input portion, a rectification portion, a smoothing portion, a power conversion portion, a power supply output portion, a signal input portion, a control portion, a circuit substrate, and a case. The circuit substrate is formed in an elongated rectangular plate-like shape. The power supply input portion is mounted on a first end portion of the circuit substrate in a longitudinal direction. The rectification portion, the smoothing portion, the power conversion portion, the control portion, and the power supply output portion are mounted on the circuit substrate in the stated order from the first end portion toward a second end portion in the longitudinal direction. The signal input portion is mounted at a position closer to the second end portion than the rectification portion in the circuit substrate.

Abstract: A light-emitting device (1) includes a base (10), a light-emitting element (11) placed on the base (10), and a wavelength converting layer (12) that covers the light-emitting element (11). The wavelength converting layer (12) includes a wavelength converting portion (13) that converts a wavelength of light from the light-emitting element (11), and a light guide portion (14) made of a light-transmitting material, and the light guide portion (14) extends from a light-emitting element (11) side to a light extraction side of the wavelength converting layer (12). Consequently, it is possible to provide a light-emitting device that can be miniaturized and reduced in thickness easily and can prevent a decrease in the light extraction efficiency.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base including a mounting surface on which the light emitting module is mounted, a circuit unit provided at a side of a rear surface of the base opposite to the mounting surface and configured to drive the light emitting unit; and a circuit case which accommodates and holds the circuit unit in an internal space thereof. The circuit case includes a tubular portion having an opening arranged to face the rear surface of the base and an insulation portion interposed between the rear surface of the base and the circuit unit to cover the opening of the tubular portion. The insulation portion includes a window through which the internal space of the circuit case leads to the rear surface of the base.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Abstract: A lamp comprises a light emitting module including a substrate and LEDs mounted on the substrate, a heat sink that is cylindrical and that discharges heat produced during light emission by the LEDs, a base provided at one end of the heat sink, a mounting member having a front surface whereon the light emitting module is mounted, and a circuit unit positioned partially in the heat sink, receiving power through the base and causing the light emitting element to emit light. The mounting member is in contact with the heat sink so that the heat produced during light emission is transmitted to the heat sink. The circuit unit includes a circuit board and a plurality of electronic components mounted on the circuit board. The circuit board or at least one of the electronic components is thermally connected to the mounting member through a thermally conductive member.

Abstract: One end of a cylindrical mount 10 is attached to an end of a cylindrical base 30 that is to be inserted into a socket of a lighting fixture. The end of the mount 10 is rotatable around a central axis of a base 30. A support 40 is attached to other end of the mount 10 so as to rotate integrally with the mount 10. An LED module 51 that includes a plurality of LED chips is attached to the support 40. An end face 43a, on which the LED module 51 is attached, is provided on the support 40. The end face 43a is formed so that the direction of light emitted by the LED chips provided on the LED module 51 is inclined at a predetermined angle with respect to the axial direction of the base 30.

Abstract: One end of a cylindrical mount 10 is attached to an end of a cylindrical base 30 that is to be inserted into a socket of a lighting fixture. The end of the mount 10 is rotatable around a central axis of a base 30. A support 40 is attached to other end of the mount 10 so as to rotate integrally with the mount 10. An LED module 51 that includes a plurality of LED chips is attached to the support 40. An end face 43a, on which the LED module 51 is attached, is provided on the support 40. The end face 43a is formed so that the direction of light emitted by the LED chips provided on the LED module 51 is inclined at a predetermined angle with respect to the axial direction of the base 30.

Abstract: A light-emitting device (1) includes a base (10), a light reflecting member (11) placed on the base (10), a case (12) surrounding the light reflecting member (11), and a plurality of light-emitting elements (13) arranged on the inner surface of the case (12). The light reflecting member (11) reflects light emitted from an emission source including the light-emitting elements (13) toward an opening (12a) of the case (12). In the light-emitting device (1), since a plurality of light-emitting elements (13) can be arranged three-dimensionally, the size of the light-emitting device can be reduced easily. Moreover, the light reflecting member (11) reflects light emitted from the emission source including the light-emitting elements (13) toward the opening (12a) of the case (12), so that the light-emitting device can have high brightness.

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract: A light-emitting device (1) includes a base (10), a light-emitting element (11) placed on the base (10), and a wavelength converting layer (12) that covers the light-emitting element (11). The wavelength converting layer (12) includes a wavelength converting portion (13) that converts a wavelength of light from the light-emitting element (11), and a light guide portion (14) made of a light-transmitting material, and the light guide portion (14) extends from a light-emitting element (11) side to a light extraction side of the wavelength converting layer (12). Consequently, it is possible to provide a light-emitting device that can be miniaturized and reduced in thickness easily and can prevent a decrease in the light extraction efficiency.

Abstract: A light-emitting device (1) includes: a base (11); a light-emitting element (12) that is disposed on one principal surface (11a) of the base (11); and a light distribution control reflector (14) that is disposed so as to surround the light-emitting element (12). The light distribution control reflector (14) is at least part of a substantial paraboloid of revolution, and a substantial paraboloid-of-revolution surface (14a) that constitutes an inner surface of the light distribution control reflector (14) is a light-reflecting surface for collecting light emitted from the light-emitting element (12). The light-emitting element (12) is disposed at a position of a substantial focal point of the substantial paraboloid-of-revolution surface (14a), and a normal (N) to the one principal surface (11a) of the base (11) is inclined toward a vertex (P) of the substantial paraboloid of revolution with respect to a direction orthogonal to an axis (X) of the substantial paraboloid of revolution.

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.