Patents by Inventor Tetsushi TANAKA

Tetsushi TANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240099141
    Abstract: A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.
    Type: Application
    Filed: October 5, 2020
    Publication date: March 21, 2024
    Applicant: KELK Ltd.
    Inventors: Hiroyuki Matsunami, Tetsushi Tanaka
  • Patent number: 11920077
    Abstract: No studies have been made regarding what kinds of refrigerants should be used in a refrigeration cycle device for a vehicle. An air conditioner (1) for a vehicle includes a refrigerant circuit (10) and a refrigerant that is sealed in the refrigerant circuit (10). The refrigerant circuit (10) includes a compressor (80), a first heat exchanger (85), which serves as a heat dissipater in a dehumidifying heating mode, an outside-air heat exchanger (82), a cooling control valve (87), and a second heat exchanger (86), which serves as an evaporator in the dehumidifying heating mode. The refrigerant is a refrigerant having a low GWP.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 5, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Eiji Kumakura, Kazuhiro Furusho, Masaru Tanaka, Shun Ohkubo, Mitsushi Itano, Yuuki Yotsumoto, Akihito Mizuno, Tomoyuki Gotou, Yasufu Yamada, Tatsumi Tsuchiya, Kenji Gobou, Hitomi Kuroki, Daisuke Karube, Tatsuya Takakuwa, Tetsushi Tsuda
  • Publication number: 20230389427
    Abstract: A thermoelectric module for optical communication includes a first substrate and a second substrate that are a pair of substrates disposed opposite to each other, a plurality of thermoelectric conversion elements disposed between the first substrate and the second substrate, a first electrode and a second electrode that are a pair of electrodes connecting the thermoelectric conversion elements, a metallized portion disposed on the second substrate, a post electrode, of an anode, electrically connected to the first electrode and the second electrode, a post electrode, of a cathode, electrically connected to the first electrode and the second electrode, and a wire as a conductor structure electrically connecting the metallized portion and a part having a lower voltage than the post electrode of the anode.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 30, 2023
    Inventors: Takaaki OHTA, Tetsushi TANAKA
  • Patent number: 11665964
    Abstract: A method for manufacturing a thermoelectric conversion element includes forming a thermoelectric film containing a thermoelectric material on a surface of a substrate, pressing the thermoelectric film with a mold to form a pattern of the thermoelectric film on the surface of the substrate, and heating the pattern of the thermoelectric film formed on the surface of the substrate to generate the thermoelectric conversion element.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: May 30, 2023
    Assignee: KELK Ltd.
    Inventors: Tetsushi Tanaka, Katsushi Fukuda, Mikio Koyano, Tatsuya Shimoda
  • Publication number: 20230006123
    Abstract: A thermoelectric module includes a substrate; a thermoelectric element; a bonding portion including an electrode that bonds the substrate and the thermoelectric element; an organic material film that covers a front surface of the bonding portion; and an inorganic material film that covers the organic material film.
    Type: Application
    Filed: November 16, 2020
    Publication date: January 5, 2023
    Inventors: Takaaki OHTA, Tetsushi TANAKA, Hiroyuki MATSUNAMI, Haruka KOREEDA
  • Publication number: 20220173298
    Abstract: A thermoelectric module includes a substrate, an electrode provided on a first surface of the substrate, a thermoelectric element, and a first diffusion prevention layer disposed between the electrode and the thermoelectric element. The first diffusion prevention layer includes a first material having a lower ionization tendency than that of hydrogen.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 2, 2022
    Inventors: Tetsushi TANAKA, Katsushi FUKUDA, Akio KONISHI, Hiroyuki MATSUNAMI, Takaaki OHTA, Haruka KOREEDA
  • Publication number: 20210202820
    Abstract: A method for manufacturing a thermoelectric conversion element includes forming a thermoelectric film containing a thermoelectric material on a surface of a substrate, pressing the thermoelectric film with a mold to form a pattern of the thermoelectric film on the surface of the substrate, and heating the pattern of the thermoelectric film formed on the surface of the substrate to generate the thermoelectric conversion element.
    Type: Application
    Filed: July 11, 2019
    Publication date: July 1, 2021
    Inventors: Tetsushi TANAKA, Katsushi FUKUDA, Mikio KOYANO, Tatsuya SHIMODA