Abstract: Unidirectional light is radiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is radiated onto the bump-formation surface in inclined directions to acquire a second overall image. First bump inspection images are respectively acquired from the first overall image, and second bump inspection images are respectively acquired from the second overall image. Then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Hereby, bump inspection with high precision and efficiency is achieved.

Abstract: Unidirectional light is irradiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is irradiated onto the bump-formation surface in respective inclined directions to acquire a second overall image, first bump inspection images are respectively acquired from the first overall image, second bump inspection images are respectively acquired from the second overall image, then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Herewith, bump inspection with high precision and efficiency is achieved.