Patents by Inventor Tetsutoshi Awamura

Tetsutoshi Awamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing device, substrate processing method, and developing device
    Patent number: 7387455
    Abstract: Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: June 17, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Tetsutoshi Awamura, Yukio Kiba, Keiichi Tanaka, Takahiro Okubo, Shuuichi Nishikido
  • Substrate processing device, substrate processing method, and developing device
    Publication number: 20050223980
    Abstract: Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.
    Type: Application
    Filed: May 16, 2003
    Publication date: October 13, 2005
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tetsutoshi Awamura, Yukio Kiba, Keiichi Tanaka, Takahiro Okubo, Shuuichi Nishikido