Patents by Inventor Tetsutsugu Hamano
Tetsutsugu Hamano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220149260Abstract: To provide a technique for sealing a plurality of thermoelectric elements in a thermoelectric conversion module. A thermoelectric conversion module includes a substrate, a plurality of second electrodes, a plurality of thermoelectric elements, a cover portion, and a pair of terminal electrodes. The substrate has an electrode surface on which a plurality of first electrodes are provided. The plurality of second electrodes face the plurality of first electrodes. The plurality of thermoelectric elements are disposed between the plurality of first electrodes and the plurality of second electrodes and include P-type thermoelectric elements and N-type thermoelectric elements alternately connected in series using the plurality of first electrodes and the plurality of second electrodes. The cover portion seals the plurality of second electrodes and the plurality of thermoelectric elements on the electrode surface.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Inventors: Tetsutsugu HAMANO, Takahiro HAYASHI
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Patent number: 10665768Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.Type: GrantFiled: October 12, 2018Date of Patent: May 26, 2020Assignees: YAMAHA CORPORATION, TOPPAN PRINTING CO., LTD., TOYOTA TSUSHO CORPORATIONInventors: Tetsutsugu Hamano, Takahiro Hayashi, Yuma Horio, Tomoaki Taniguchi, Yuki Muroi, Takashi Nakamura
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Publication number: 20190081226Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.Type: ApplicationFiled: October 12, 2018Publication date: March 14, 2019Inventors: Tetsutsugu HAMANO, Takahiro HAYASHI, Yuma HORIO, Tomoaki TANIGUCHI, Yuki MUROI, Takashi NAKAMURA
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Publication number: 20100108117Abstract: A package is adapted to a thermoelectric module in which a plurality of thermoelectric elements is electrically connected in series and aligned between a lower electrode and an upper electrode and is constituted of a metal frame and a metal base which is a metal plate having good thermal conductivity composed of copper, aluminum, silver, or alloy. The metal frame is bonded onto the periphery of the metal base via a low melting point solder whose melting point is lower than that of the solder used for forming the thermoelectric module. The thermoelectric module is circumscribed by the metal frame so that the lower electrode thereof is attached onto the metal base via an insulating resin layer.Type: ApplicationFiled: October 28, 2009Publication date: May 6, 2010Applicant: YAMAHA CORPORATIONInventors: TETSUTSUGU HAMANO, Hiroyuki Yamashita, Naoshi Horiai
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Patent number: 7518205Abstract: A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is bonded to the substrate with a seal ring which is directly bonded to the substrate by brazing without an intervening nickel plating layer. The leads are nickel plated and gold plated after hermetic sealing, and the seal ring is nickel plated and gold plated after brazing. Even though the substrate is made of a metal alloy, this arrangement provides the package with a high degree of air tightness.Type: GrantFiled: March 9, 2005Date of Patent: April 14, 2009Assignee: Yamaha CorporationInventors: Katsunori Suzuki, Tetsutsugu Hamano
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Patent number: 7313292Abstract: An optical component comprises an optical transmission element (e.g., an optical lens) whose circumferential wall partially joins a metal holder via a joining material (e.g., a low melting point glass), wherein stress is normally applied to the optical transmission element in a compression direction when joining the metal holder. The optical transmission element is inserted into a through hole of the metal holder, and the joining material is kept in a bank actualized by a tapered portion formed in proximity to one end of the through hole of the metal holder. This prevents tensile stress from being applied to the optical transmission element; thus, it is possible to avoid the occurrence of cracks and separations in the optical transmission element; and it is possible to avoid the occurrence of errors in optical characteristics, regardless of variations of the environmental temperature, so that, the optical component is improved in reliability.Type: GrantFiled: September 16, 2004Date of Patent: December 25, 2007Assignees: Mitsubishi Denki Kabushiki Kaisha, Yamaha CorporationInventors: Yoshihiro Hashimoto, Ken Matsuoka, Shinichi Takagi, Katsunori Suzuki, Tetsutsugu Hamano
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Patent number: 7087501Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.Type: GrantFiled: July 13, 2005Date of Patent: August 8, 2006Assignee: Yamaichi Electronics, Co., Ltd.Inventors: Atsuo Hattori, Toshitaka Yoshino, Tetsutsugu Hamano, Masahiro Sugiura
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Publication number: 20050266690Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.Type: ApplicationFiled: July 13, 2005Publication date: December 1, 2005Inventors: Atsuo Hattori, Toshitaka Yoshino, Tetsutsugu Hamano, Masahiro Sugiura
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Publication number: 20050214979Abstract: A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is bonded to the substrate with a seal ring which is directly bonded to the substrate by brazing without an intervening nickel plating layer. The leads are nickel plated and gold plated after hermetic sealing, and the seal ring is nickel plated and gold plated after brazing. Even though the substrate is made of a metal alloy, this arrangement provides the package with a high degree of airtightness.Type: ApplicationFiled: March 9, 2005Publication date: September 29, 2005Inventors: Katsunori Suzuki, Tetsutsugu Hamano
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Patent number: 6946375Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.Type: GrantFiled: March 19, 2002Date of Patent: September 20, 2005Assignee: Yamaha CorporationInventors: Atsuo Hattori, Toshitaka Yoshino, Tetsutsugu Hamano, Masahiro Sugiura
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Publication number: 20050099703Abstract: An optical component comprises an optical transmission element (e.g., an optical lens) whose circumferential wall partially joins a metal holder via a joining material (e.g., a low melting point glass), wherein stress is normally applied to the optical transmission element in a compression direction when joining the metal holder. The optical transmission element is inserted into a through hole of the metal holder, and the joining material is kept in a bank actualized by a tapered portion formed in proximity to one end of the through hole of the metal holder. This prevents tensile stress from being applied to the optical transmission element; thus, it is possible to avoid the occurrence of cracks and separations in the optical transmission element; and it is possible to avoid the occurrence of errors in optical characteristics, regardless of variations of the environmental temperature, so that, the optical component is improved in reliability.Type: ApplicationFiled: September 16, 2004Publication date: May 12, 2005Inventors: Yoshihiro Hashimoto, Ken Matsuoka, Shinichi Takagi, Katsunori Suzuki, Tetsutsugu Hamano
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Publication number: 20020137316Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.Type: ApplicationFiled: March 19, 2002Publication date: September 26, 2002Inventors: Atsuo Hattori, Toshitaka Yoshino, Tetsutsugu Hamano, Masahiro Sugiura