Patents by Inventor Tetsuya Akamatsu
Tetsuya Akamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230349083Abstract: An object of the present invention is to provide a stitched fiber-reinforced substrate material capable of suppressing the formation of microcracks in a fiber reinforced composite material. The stitched fiber-reinforced substrate material of the present invention is a stitched fiber-reinforced substrate material formed by stitching reinforcement fiber sheets made of reinforcement fibers using stitching yarns, to which an organic compound having a polar group is adhered. The organic compound having a polar group is preferably a compound having a polyoxyalkylene structure, and also preferably a compound having an epoxy group. The organic compound having a polar group is preferably adhered in an amount of 0.1 to 10 wt % with respect to the mass of the stitching yarn.Type: ApplicationFiled: February 22, 2021Publication date: November 2, 2023Applicant: TEIJIN LIMITEDInventors: Tetsuya AKAMATSU, Kohei OSAKI, Toru KANEKO
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Publication number: 20230151165Abstract: A high-concentration particle-containing film that contains a large amount of particles while having excellent flexibility is provided. The high-concentration particle-containing film of the invention includes a para-copolymerized aromatic polyamide obtained by copolymerization of para-phenylenediamine, a copolymerizing diamine and para-terephthaloyl dichloride, and particles, wherein the weight proportion of the copolymerizing diamine is in the range of 25 to 75 wt % of the entire diamine component and the particles are present at 55 vol % or greater, and the copolymerizing diamine is 3,3?-oxydiphenylenediamine, 3,4?-oxydiphenylenediamine or 4,4?-oxydiphenylenediamine.Type: ApplicationFiled: November 10, 2022Publication date: May 18, 2023Applicant: Teijin LimitedInventor: Tetsuya AKAMATSU
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Publication number: 20230139781Abstract: An object of the present invention is to provide a stitched fiber-reinforced substrate material capable of suppressing the formation of microcracks in a fiber reinforced composite material. The stitched fiber-reinforced substrate material of the present invention is a fiber-reinforced substrate material formed by stitching reinforcement fiber sheets made of reinforcement fibers using stitching yarns, and the stitching yarn has a linear expansion coefficient in the fiber axial direction of ?1×10?6 to 70×10?6/K after being heated at 180° C. for 2 hours and then cooled. The stitching yarn is preferably a stitching yarn to which an organic compound having a polar group is adhered.Type: ApplicationFiled: February 22, 2021Publication date: May 4, 2023Applicant: Teijin LimitedInventors: Tetsuya AKAMATSU, Kohei OSAKI, Toru KANEKO
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Publication number: 20230124757Abstract: An object of the present invention is to provide a stitched fiber-reinforced substrate material capable of suppressing the formation of microcracks in a fiber reinforced composite material. The stitched fiber-reinforced substrate material of the present invention is a stitched fiber-reinforced substrate material formed by stitching reinforcement fiber sheets made of reinforcement fibers using stitching yarns that exhibit an in-plane shear strength transition rate of 5% or more. The stitching yarn is preferably adhered by an organic compound having a polar group.Type: ApplicationFiled: February 22, 2021Publication date: April 20, 2023Applicant: TEIJIN LIMITEDInventors: Tetsuya AKAMATSU, Kohei OSAKI, Toru KANEKO
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Patent number: 11352472Abstract: The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ? (?cm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1). t/?×1/L×100?0.Type: GrantFiled: April 13, 2017Date of Patent: June 7, 2022Assignee: TEIJIN LIMITEDInventors: Kazuma Kurokawa, Tetsuya Akamatsu, Hiroaki Kuwahara
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Publication number: 20210194006Abstract: Provided is a binder for use in an electrode layer or separator for a lithium-ion secondary battery, wherein the binder is unlikely to cause powder removal and does not completely cover the surface of the active material particles when used in an electrode layer as a binder. The binder of the present invention is a binder for a non-aqueous secondary battery, the binder comprising a fibrid of an aromatic polyamide, wherein the fibrid swells and is not dissolved in an N-methyl-2-pyrrolidone solvent in which an alkali metal salt and/or an alkaline earth metal salt is present at a concentration of 1,000 ppm or less, and is completely dissolved in an N-methyl-2-pyrrolidone solvent in which an alkali metal salt and/or an alkaline earth metal salt is present at a concentration of 10,000 ppm or more.Type: ApplicationFiled: June 28, 2019Publication date: June 24, 2021Applicant: TEIJIN LIMITEDInventor: Tetsuya AKAMATSU
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Publication number: 20200247964Abstract: A high-concentration particle-containing film that contains a large amount of particles while having excellent flexibility is provided. The high-concentration particle-containing film of the invention includes a para-copolymerized aromatic polyamide obtained by copolymerization of para-phenylenediamine, a copolymerizing diamine and para-terephthaloyl dichloride, and particles, wherein the weight proportion of the copolymerizing diamine is in the range of 25 to 75 wt % of the entire diamine component and the particles are present at 55 vol % or greater, and the copolymerizing diamine is 3,3?-oxydiphenylenediamine, 3,4?-oxydiphenylenediamine or 4,4?-oxydiphenylenediamine.Type: ApplicationFiled: June 27, 2018Publication date: August 6, 2020Applicant: TEIJIN LIMITEDInventor: Tetsuya AKAMATSU
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Publication number: 20190062511Abstract: The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ? (?cm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1). t/?×1/L×100?0.Type: ApplicationFiled: April 13, 2017Publication date: February 28, 2019Applicant: TEIJIN LIMITEDInventors: Kazuma KUROKAWA, Tetsuya AKAMATSU, Hiroaki KUWAHARA
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Publication number: 20190044118Abstract: A separator for a non-aqueous secondary battery that is composed of a composite membrane containing a porous substrate, and a heat-resistant adhesive porous layer provided on one side or both sides of the porous substrate, in which the heat-resistant adhesive porous layer contains an acrylic type resin, and a heat-resistant resin that has a glass transition temperature of 200° C. or more and that has an amide-structure.Type: ApplicationFiled: July 25, 2018Publication date: February 7, 2019Applicant: TEIJIN LIMITEDInventors: Hiroshi SAKURAI, Satoshi NISHIKAWA, Tetsuya AKAMATSU
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Patent number: 8916310Abstract: A conductive sheet comprises an aromatic polyamide pulp, a fluoroplastic fused to the aromatic polyamide pulp, and a carbon-based conductive material; wherein the conductive sheet has a static contact angle of water on a first surface that is greater than the static contact angle of water on a second surface that in the opposite surface to the first surface, and the difference between the static contact angle of water on the first surface and the static contact angle of water on the second surface is 20°-180°; or wherein the injection pressure of water on the first surface of the conductive sheet is less than the injection pressure of water on the second surface that is the opposite surface to the first surface, and the difference between the injection pressure of water on the first surface and the injection pressure of water on the second surface is 20-50 kPa.Type: GrantFiled: August 24, 2011Date of Patent: December 23, 2014Assignee: Toho Tenax Co., Ltd.Inventors: Kazuma Kurokawa, Tetsuya Akamatsu
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Patent number: 8883303Abstract: The invention pertains to a method for making a polymer-additive composite particle from a dope by jet spinning the dope to obtain a pulp, fibril or fibrid, wherein the solvent of the dope is selected from N-methyl-2-pyrrolidone, N,N?-dimethylformamide, N,N?-dimethylacetamide, tetramethylurea, and 4 to 75 wt % of a composition consisting of 2 to 95 wt % of a para-aramid polymer and 5-98 wt % of a solid additive material, to a total of 100 wt %, and wherein the aramid polymer is dissolved in the solvent; or coagulating the dope by means of a rotor-stator apparatus in which the polymer solution is applied through the stator on the rotor so that the precipitating polymer-additive composite particle is subjected to shear forces while they are in a plastic deformable stage.Type: GrantFiled: February 12, 2013Date of Patent: November 11, 2014Assignee: Teijin Aramid B.V.Inventors: Anton Johannes Josef Hendriks, Mirjam Ellen Oldenzeel, Johannus Maria Bergmans, Tetsuya Akamatsu
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Publication number: 20130157171Abstract: A conductive sheet comprises an aromatic polyamide pulp, a fluoroplastic fused to the aromatic polyamide pulp, and a carbon-based conductive material; wherein the conductive sheet has a static contact angle of water on a first surface that is greater than the static contact angle of water on a second surface that in the opposite surface to the first surface, and the difference between the static contact angle of water on the first surface and the static contact angle of water on the second surface is 20°-180°; or wherein the injection pressure of water on the first surface of the conductive sheet is less than the injection pressure of water on the second surface that is the opposite surface to the first surface, and the difference between the injection pressure of water on the first surface and the injection pressure of water on the second surface is 20-50 kPa.Type: ApplicationFiled: August 24, 2011Publication date: June 20, 2013Applicant: TOHO TENAX CO., LTD.Inventors: Kazuma Kurokawa, Tetsuya Akamatsu
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Patent number: 8398906Abstract: The invention pertains to a method for making a polymer-additive composite particle from a dope by jet spinning the dope to obtain a pulp, fibril or fibrid, wherein the solvent of the dope is selected from N-methyl-2-pyrrolidone, N,N?-dimethylformamide, N,N?-dimethylacetamide, tetramethylurea, and 4 to 75 wt % of a composition consisting of 2 to 95 wt % of a para-aramid polymer and 5-98 wt % of a solid additive material, to a total of 100 wt %, and wherein the aramid polymer is dissolved in the solvent; or coagulating the dope by means of a rotor-stator apparatus in which the polymer solution is applied through the stator on the rotor so that the precipitating polymer-additive composite particle is subjected to shear forces while they are in a plastic deformable stage.Type: GrantFiled: March 28, 2008Date of Patent: March 19, 2013Assignee: Teijin Aramid B.V.Inventors: Anton Johannes Josef Hendriks, Mirjam Ellen Oldenzeel, Johannus Maria Bergmans, Tetsuya Akamatsu
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Patent number: 7977982Abstract: A semiconductor integrated circuit, including: a logic section; an initiating current generating section for generating initiating current for initiating or re-initiating a circuit when the circuit is to be initiated or the circuit operates abnormally; an initiating current detecting section for detecting the initiating current of the initiating current generating section and outputting a detection signal indicating whether or not the initiating current generating section operates normally; and a signal selection section for selecting one of the detection signal and an output from the logic section based on an internal signal of the logic section which is controllable from outside of the logic section, and outputting the selected one to a terminal.Type: GrantFiled: February 23, 2006Date of Patent: July 12, 2011Assignee: Sharp Kabushiki KaishaInventors: Tetsuya Akamatsu, Hideki Shioe, Haruya Mori
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Publication number: 20100056731Abstract: The invention pertains to a method for making a polymer-additive composite particle from a dope by jet spinning the dope to obtain a pulp, fibril or fibrid, wherein the solvent of the dope is selected from N-methyl-2-pyrrolidone, N,N?-dimethylformamide, N,N?-dimethylacetamide, tetramethylurea, and 4 to 75 wt % of a composition consisting of 2 to 95 wt % of a para-aramid polymer and 5-98 wt % of a solid additive material, to a total of 100 wt %, and wherein the aramid polymer is dissolved in the solvent; or coagulating the dope by means of a rotor-stator apparatus in which the polymer solution is applied through the stator on the rotor so that the precipitating polymer-additive composite particle is subjected to shear forces while they are in a plastic deformable stage.Type: ApplicationFiled: March 28, 2008Publication date: March 4, 2010Applicant: Teijin Aramid B.V.Inventors: Anton Johannes Josef Hendriks, Mirjam Ellen Oldenzeel, Johannus Maria Bergmans, Tetsuya Akamatsu
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Patent number: 7166916Abstract: A semiconductor integrated circuit is so structured that a first insulating layer is formed on a surface of a semiconductor chip and a second insulating layer covers an entire region of the surface of the semiconductor chip. Via apertures made to the second insulating layer, an electrical connection configuration is formed from above the second insulating layer by using gold wires. Then, an electronic component is mounted on the second insulating layer. By arranging as such, the electronic component is mounted on the semiconductor chip in advance. Therefore, it is possible to further reduce mounting space on a printed-wiring board and also possible to make is easy to attain one-packaged IC.Type: GrantFiled: November 23, 2004Date of Patent: January 23, 2007Assignee: Sharp Kabushiki KaishaInventors: Tetsuya Akamatsu, Masanori Inamori
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Publication number: 20060271324Abstract: A semiconductor integrated circuit, including: a logic section; an initiating current generating section for generating initiating current for initiating or re-initiating a circuit when the circuit is to be initiated or the circuit operates abnormally; an initiating current detecting section for detecting the initiating current of the initiating current generating section and outputting a detection signal indicating whether or not the initiating current generating section operates normally; and a signal selection section for selecting one of the detection signal and an output from the logic section based on an internal signal of the logic section which is controllable from outside of the logic section, and outputting the selected one to a terminal.Type: ApplicationFiled: February 23, 2006Publication date: November 30, 2006Inventors: Tetsuya Akamatsu, Hideki Shioe, Haruya Mori
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Patent number: 6972602Abstract: A power-on reset circuit comprises a power supply voltage detection circuit that detects a rise of a power supply voltage and that changes a logic level of a first internal node; a capacitor charge/discharge circuit that charges and discharges a capacitor according to the first internal node level and that in an event that the power supply voltage is reduced, discharges the capacitor to follow the event; and a reset pulse generation circuit that before the power supply voltage rises higher than the predetermined voltage, outputs a first output voltage to an output node and that after the power supply voltage has risen higher than the predetermined voltage, outputs a second output voltage to the output node upon detecting that a charge level of the capacitor has become higher than a charge level detection voltage.Type: GrantFiled: April 22, 2004Date of Patent: December 6, 2005Assignee: Sharp Kabushiki KaishaInventors: Tetsuya Akamatsu, Hiroki Doi, Masanori Inamori
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Publication number: 20050224962Abstract: A semiconductor integrated circuit is so structured that a first insulating layer is formed on a surface of a semiconductor chip and a second insulating layer covers an entire region of the surface of the semiconductor chip. Via apertures made to the second insulating layer, an electrical connection configuration is formed from above the second insulating layer by using gold wires. Then, an electronic component is mounted on the second insulating layer. By arranging as such, the electronic component is mounted on the semiconductor chip in advance. Therefore, it is possible to further reduce mounting space on a printed-wiring board and also possible to make is easy to attain one-packaged IC.Type: ApplicationFiled: November 23, 2004Publication date: October 13, 2005Inventors: Tetsuya Akamatsu, Masanori Inamori
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Publication number: 20040212409Abstract: A power-on reset circuit comprises a power supply voltage detection circuit that detects a rise of a power supply voltage and that changes a logic level of a first internal node; a capacitor charge/discharge circuit that charges and discharges a capacitor according to the first internal node level and that in an event that the power supply voltage is reduced, discharges the capacitor to follow the event; and a reset pulse generation circuit that before the power supply voltage rises higher than the predetermined voltage, outputs a first output voltage to an output node and that after the power supply voltage has risen higher than the predetermined voltage, outputs a second output voltage to the output node upon detecting that a charge level of the capacitor has become higher than a charge level detection voltage.Type: ApplicationFiled: April 22, 2004Publication date: October 28, 2004Inventors: Tetsuya Akamatsu, Hiroki Doi, Masanori Inamori