Abstract: A communication device may include: a memory configured to store management information in which, for each of a plurality of OIDs of a MIB, the OID and a setting value are associated with each other; and a controller, wherein the controller may be configured to: receive a setting command which conforms to TCP; write the setting value included in the setting command to the management information in association with the OID included in the setting command; and send a response command which conforms to the TCP. In a case where the setting command including a first OID and a first setting value is received, the controller may be configured to: write the first setting value to the management information in association with the first OID after the response command has been sent, and send the response command before the first setting value is written to the management information.

Abstract: A piezoelectric film laminated body includes a base member and a scandium-containing aluminum nitride film. The base member has a base surface. The scandium-containing aluminum nitride film is disposed in contact with the base surface of the base member. A surface roughness of the base surface is 0.5 nm or less in arithmetic average roughness.

Abstract: An electroacoustic transducer includes a vibrating portion, a slit and an elastic film. The vibrating portion has a fixed end portion and a free end portion, and extends as a cantilever from the fixed end portion toward the free end portion along an extending direction orthogonal to a directivity axis to vibrate in a manner that the free end portion moves along the directivity axis. The slit is formed at two ends of the vibrating portion in a width direction orthogonal to the directivity axis and orthogonal to the extending direction. The elastic film is provided to close the slit in an axial direction that is aligned with the directivity axis. The slit includes a wide portion provided on a free end side and a narrow portion narrower than the wide portion. The elastic film is provided to close the wide portion while not closing the narrow portion.

Abstract: A method for producing a polyimide precursor having a structural unit represented by the following formula (1), comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond: (i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and (ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1): wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):

Abstract: A piezoelectric device includes a base member, a first conductive film arranged above the base member in contact with an upper surface of the base member, a piezoelectric film arranged above the first conductive film in contact with an upper surface of the first conductive film, a second conductive film arranged on the piezoelectric film, and an insulating portion provided inside a trench penetrating through the piezoelectric film and the first conductive film. The insulating portion has a higher electrical resistivity than the piezoelectric film.

Abstract: A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.

Abstract: A micro-electro-mechanical systems (MEMS) sensor includes a substrate, a diaphragm portion and a piezoelectric film. The diaphragm portion is located at the substrate. The piezoelectric film is located on the diaphragm portion. The piezoelectric film is made of scandium aluminum nitride. A carbon concentration of the piezoelectric film is 2.5 atomic percent or less while an oxygen concentration of the piezoelectric film is 0.35 atomic percent or less.

Abstract: A piezoelectric device includes a support member, and a vibrating portion provided on a support surface of the support member. The vibrating portion includes, in addition to a first electrode, a piezoelectric film and a second electrode arranged in a stacking direction, an insulating film configured to increase an electric resistance value between the first and second electrodes. The first electrode is provided on the support surface of the support member, and includes an opening penetrating the first electrode in the stacking direction. The piezoelectric film is provided on the first electrode to extend across the opening. The second electrode is provided on the piezoelectric film. The insulating film is provided at a position between the first electrode and the second electrode, and at least a part of the insulating film overlaps with the opening in the stacking direction.

Abstract: A piezoelectric film laminated body includes a metal film, an amorphous film, and a scandium aluminum nitride film. The amorphous film has an insulation property and is disposed on the metal film. The scandium aluminum nitride film is disposed on the amorphous film and is in contact with a surface of the amorphous film.

Abstract: A microelectromechanical systems device includes a vibrator and a reinforcing film. The vibrator includes a piezoelectric element configured to convert pressure to an electrical signal. The reinforcing film is configured to reinforce strength of the vibrator. The vibrator further has a groove at which a portion of the reinforcing film is disposed.

Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

Abstract: A photosensitive resin composition of the invention contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a photopolymerization initiator comprising a compound represented by the formula (11), (C) a thermal radical generator, and (D) a solvent containing ?-butyrolactone: wherein in the formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group comprising a substituted or unsubstituted carbazolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a group comprising a cycloalkyl group including 4 to 10 carbon atoms, a group comprising a phenyl group, or a group comprising a tolyl group; R13 is a substituted or unsubstituted aromatic hydrocarbon group including 6 to 20 carbon atoms.

Abstract: A piezoelectric film layered structure includes a base, and a ScAlN film formed on the base. The ScAlN film has an unpaired electron density within a range between 1.7×1018 electrons/cm3, inclusive, and 1.1×1019 electrons/cm3, inclusive.

Abstract: A photosensitive resin composition comprising: (A) a polyimide precursor having a polymerizable unsaturated bond; (B) one or more selected from compounds represented by any of the following formulas (1) to (4); and (C) a photopolymerization initiator represented by the following formula (11), wherein in the formulas (1) to (4), R1, R2, and R8 are independently an alkyl group including 1 to 4 carbon atoms, and R3 to R7 are independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; s is an integer of 0 to 8; t is an integer of 0 to 4; r is an integer of 0 to 4; and in the formula (11), R11 is an alkyl group including 1 to 12 carbon atoms, an alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and R13 is a substituted or unsubstituted benzoyl group, a substituted or unsubstitute

Abstract: A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

Abstract: A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.

Abstract: A method for producing a polyimide precursor having a structural unit represented by the following formula (1), comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond: (i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and (ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1): wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):

Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.

Abstract: A MEMS device includes a fixed portion fixed to a pedestal, a movable portion arranged inside the fixed portion and configured to be displaceable with respect to the fixed portion, a connecting portion that connects the fixed portion and the movable portion, a piezoelectric element disposed on at least one of the fixed portion or the connecting portion, and a detection portion that output a signal corresponding to a distortion of the movable portion. A voltage is applied to the piezoelectric element on the basis of the output signal of the detection portion thereby reducing the distortion transmitted from the fixed portion to the movable portion.

Abstract: A variable focus mirror includes a base portion, a first piezoelectric element, a reflection surface portion, and a second piezoelectric element. The base portion has a plate shape with a recessed portion on a back surface. The first piezoelectric element is arranged on a front surface of the base portion where the recessed portion is arranged. The reflection surface portion is arranged on the first piezoelectric element. The reflection surface portion is arranged opposite to the base portion with respect to the first piezoelectric element. The second piezoelectric element is arranged on the front surface of the base portion. The second piezoelectric element covers the part of the base portion where the recessed portion is arranged and the part of the base portion outside the recessed portion. The second piezoelectric element is separated from the first piezoelectric element.