Abstract: Methods, systems, and devices for programming power management circuits in a system are described. An apparatus may include a set of one or more power management circuits configured to provide one or more operating voltages for the apparatus. The apparatus may also include an interface coupled with a controller via a bus. The apparatus may include a first switching circuit configured to isolate the bus from the controller and to couple the bus with a second switching circuit. The second switching circuit may be configured to isolate the set of one or more power management circuits from the controller and to couple the set of one or more power management circuits with the first switching circuit.

Abstract: A novel method for forming a positive electrode active material is provided. In the method for forming a positive electrode active material, a cobalt source and an additive element source are mixed to form an acidic solution; the acidic solution and an alkaline solution are made to react to form a cobalt compound; the cobalt compound and a lithium source are mixed to form a mixture; and the mixture is heated. The additive element source is a compound containing one or more selected from gallium, aluminum, boron, nickel, and indium.

Abstract: Provided by the present invention is a photocatalytic coating composition which can express excellent visibility during application work and further can, owing to its excellent physical properties, form a homogeneous photocatalyst coated film having uniform thickness on a surface of a substrate. The photocatalytic coating composition which is basic and comprises photocatalyst particles, a basic dye, a layered silicate, and a dispersion medium. The basic dye enhances visibility of the part where the photocatalytic coating composition is applied so that the applied part can be easily distinguished from the unapplied part by the difference in appearance. After application work, color of the basic dye disappears by photolysis with a solar light or by decomposition with a photocatalyst. The layered silicate suppresses color change of the basic dye over time and stably keep color tone of the same.

Abstract: Provided by the present invention is a photocatalytic coating composition which can express excellent visibility during application work and further can, owing to its excellent physical properties, form a homogeneous photocatalyst coated film having uniform thickness on a surface of a substrate. The photocatalytic coating composition which is basic and comprises photocatalyst particles, a basic dye, a layered silicate, and a dispersion medium. The basic dye enhances visibility of the part where the photocatalytic coating composition is applied so that the applied part can be easily distinguished from the unapplied part by the difference in appearance. After application work, color of the basic dye disappears by photolysis with a solar light or by decomposition with a photocatalyst. The layered silicate suppresses color change of the basic dye over time and stably keep color tone of the same.

Abstract: Provided by the present invention is a photocatalytic coating composition having small viscosity change rate and excellent storage stability. The photocatalytic coating composition comprises photocatalyst particles, a dispersion medium, a thickener, and at least one selected from the group consisting of primary to tertiary alkanol amines, wherein the thickener is at least one selected from the group consisting of a polysaccharide thickener containing glucuronic acid and/or rhamnose in its main chain and a layered silicate, the ratio of the mass of the at least one selected from the group consisting of primary to tertiary alkanol amines relative to the mass of total solid content in the photocatalytic coating composition is in the range of 2.5% or more by mass to 25% or less by mass, and liquid property of the photocatalytic coating composition is basic.

Abstract: Provided are: a circuit device demonstrating an improved connection reliability while being mounted; and a method for manufacturing the same. The circuit device of the present invention includes: an island; leads arranged around the island, each lead having a lower surface and a side surface exposed to the outside; and a semiconductor element mounted on the island and electrically connected to the leads through thin metal wires. Furthermore, the exposed end portion of the lead is formed to spread toward the outside. By forming the lead in this manner, the area where the lead comes into contact with a brazing filler material is increased, thus improving the connection strength therebetween.

Abstract: Provided are: a lead frame enabling efficient manufacturing of multiple circuit devices; and a method for manufacturing a circuit device using the same. In the lead frame of the present invention, units are arranged and frame-shaped first and second supporters are provided around the units to mechanically support the units. Moreover, a half groove is provided in the first supporter at a portion on an extended line of a dividing line defined at a boundary between each adjacent two of the units. Furthermore, a penetration groove penetrating a part of the second supporter at a portion on an extended line of another dividing line is provided.

Abstract: A microscope includes a zoom optical system zooming over a sample, a zoom driving unit moving the optical system along an optical axis, an imaging unit imaging an observation image of the sample through the optical system, thereby generating image data on the sample, and a display unit displaying an image corresponding to the generated image data. A touch panel on a display screen of the display unit accepts an input corresponding to a contact position of an object. A driving control unit outputs a driving signal for changing a zoom magnification of the optical system by setting a middle point between contact positions on the touch panel corresponding to two position signals responsive to an input of the different contact positions as a zoom center position fixed without depending on the zoom magnification of the optical system when the two position signals are output from the touch panel.

Abstract: An image data processing apparatus includes: plural arithmetic processing sections; a main memory; and a cache memory, wherein slices of the image data are sequentially and cyclically assigned to the plural arithmetic processing sections and plural slices to be processed are set as objects of processing, respectively, and the plural arithmetic processing sections process the image data in parallel to establish a consistent relationship of the processing of each slice with processing of the immediately preceding slice, in which the current slice and the immediately preceding slice can be simultaneously processed in parallel so that a reference macroblock of the macroblock in processing in the current slice may partly overlap with a reference macroblock of the macroblock in processing in the immediately preceding slice.

Abstract: Provided are: a circuit device demonstrating an improved connection reliability while being mounted; and a method for manufacturing the same. The circuit device of the present invention includes: an island; leads arranged around the island, each lead having a lower surface and a side surface exposed to the outside; and a semiconductor element mounted on the island and electrically connected to the leads through thin metal wires. Furthermore, the exposed end portion of the lead is formed to spread toward the outside. By forming the lead in this manner, the area where the lead comes into contact with a brazing filler material is increased, thus improving the connection strength therebetween.

Abstract: Provided are: a lead frame enabling efficient manufacturing of multiple circuit devices; and a method for manufacturing a circuit device using the same. In the lead frame of the present invention, units are arranged and frame-shaped first and second supporters are provided around the units to mechanically support the units. Moreover, a half groove is provided in the first supporter at a portion on an extended line of a dividing line defined at a boundary between each adjacent two of the units. Furthermore, a penetration groove penetrating a part of the second supporter at a portion on an extended line of another dividing line is provided.

Abstract: A method of producing a photocatalyst according to the invention comprises forming an amorphous titanium oxide and heat-treating it in an atmosphere containing oxygen, whereby a photocatalyst having a good photocatalysis can be obtained. In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate. This apparatus can be provided with cooling means to allow enhancement of the throughput of the film formation process.

Abstract: A recipe server executes an inspection region setup process for designating the inspection region of the object of inspection as the initial setting of a recipe; the recipe server executes optical condition setup process for setting an optical condition for the image pickup; a substrate inspection apparatus executes an image obtainment process for obtaining image data by picking up the image of the inspection object using a tentative recipe including the inspection region and optical condition which are designated by the recipe server; the recipe server executes a recipe tuning process for generating an adjusted recipe by tuning the tentative recipe using image data obtained by the substrate inspection apparatus; and the substrate inspection apparatus execute an inspection process for inspecting the inspection object on the basis of the adjusted recipe tuned by the recipe server.

Abstract: A method of producing a photocatalyst according to the invention comprises forming an amorphous titanium oxide and heat-treating it in an atmosphere containing oxygen, whereby a photocatalyst having a good photocatalysis can be obtained. In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate. This apparatus can be provided with cooling means to allow enhancement of the throughput of the film formation process.

Abstract: A method of producing a photocatalyst according to the invention comprises forming an amorphous titanium oxide and heat-treating it in an atmosphere containing oxygen, whereby a photocatalyst having a good photocatalysis can be obtained. In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate. This apparatus can be provided with cooling means to allow enhancement of the throughput of the film formation process.

Abstract: An image data processing apparatus includes: plural arithmetic processing sections; a main memory; and a cache memory, wherein slices of the image data are sequentially and cyclically assigned to the plural arithmetic processing sections and plural slices to be processed are set as objects of processing, respectively, and the plural arithmetic processing sections process the image data in parallel to establish a consistent relationship of the processing of each slice with processing of the immediately preceding slice, in which the current slice and the immediately preceding slice can be simultaneously processed in parallel so that a reference macroblock of the macroblock in processing in the current slice may partly overlap with a reference macroblock of the macroblock in processing in the immediately preceding slice.

Abstract: A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.

Abstract: A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.

Abstract: A method of producing a photocatalyst according to the invention comprises forming an amorphous titanium oxide and heat-treating it in an atmosphere containing oxygen, whereby a photocatalyst having a good photocatalysis can be obtained. In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate. This apparatus can be provided with cooling means to allow enhancement of the throughput of the film formation process.

Abstract: A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.