Abstract: A manufacturing method of a thin-film magnetic head, includes a step of forming many thin-film magnetic heads arranged along row and column directions on a wafer, each of the thin-film magnetic heads having a read head element, a write head element, and pairs of probe-use pads electrically connected with the read head element and the write head element, respectively, the pairs of probe-use pads being positioned so that at least part of each probe-use pad is removed by a cutting process along the row direction, a step of obtaining a plurality of row-bars by cutting the wafer along the row direction so that the at least part of each probe-use pad is removed, each of the obtained row-bars having the thin-film magnetic heads aligned in the row direction, a step of forming pairs of bonding pads electrically connected with the read head element and the write head element, respectively, on a surface opposite to an ABS of each thin-film magnetic head of each of the row-bars, and a step of cutting each row-bar along t

Abstract: The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to electrode films through lead-out conductive films are arranged and a chip area is defined for cutting out the plurality of elements in a given number. In the wafer, at least one evaluation element is formed in an area outside the chip area. The lead-out conductive films extend to the outside area and are connected to the evaluation elements. With this wafer, since the lead-out conductor is shared between the element and the evaluation element, the electrode film connected therewith can be shared, too.

Abstract: A method of measuring dimension of a first pattern with a narrow first width, and a second pattern with a second width wider than the first width of the first pattern and formed in a symmetrical appearance with respect to the pattern center, the second pattern having edges opposed to each other defining the second width, includes a step of forming a pair of first dummy patterns each having a narrow width, the pair of first dummy patterns being spaced from the edges of the second pattern respectively by a distance approximate to the first width of the first pattern, a first measurement step of measuring, using a dimension measuring device, a spaced distance of one of the first dummy patterns from the edge of the second pattern and a width of the one of the first dummy patterns within the same field of view of the dimension measuring device, a second measurement step of measuring, using the dimension measuring device, a width of the first pattern under the same measurement condition as that of the first measure

Abstract: A manufacturing method of a thin-film magnetic head with a dishing suppressed in the case of planarizing a magnetic shield which a read head portion has or a magnetic pole which a write head portion has is provided.

Abstract: A multi-channel thin-film magnetic head has magnetic read head elements, magnetic write head elements, servo magnetic head elements, a plurality of pairs of external connection pads for reading connected with magnetic read head elements, a plurality of pairs of external connection pads for writing connected with magnetic write head elements, a plurality of pairs of external connection pads for servo connected with servo magnetic head elements, and a plurality of connection pads for body grounding or other functions. The connection pads for reading, writing, servo and body grounding or other functions are arranged in lines on a surface of the multi-channel thin-film magnetic head, and lead conductors which are electrically connected with connection pads for reading, writing, servo and body grounding or other functions are different each other in terms of widths, shapes, connection points or existence of a connector among at least two types of connection pads.

Abstract: A thin-film magnetic head which can keep performances from fluctuating, while restraining an organic insulating material from peeling off is provided. The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.