Abstract: A low-cost leadframe in which leads are stably and securely retained. The leadframe is provided with a lead retaining section for securely retaining internal leads together. Such a lead retaining section is molded from the same thermosetting resin as used for molding a resin encapsulated package and formed on the internal leads on the side of a die pad such that it extends, in the form of a strip, over the surfaces of the internal leads arranged in rows and such that it is adhered to the internal leads and embedded in the gaps between the internal leads.

Abstract: A method of molding a pin holding structure on a lead frame having a plurality of inner lead pins associated with an island, wherein fluid resinous material is dispensed across successive ones of the inner lead pins and is then hardened while under pressure between flat presser plates. The resin is high in heat resistance as well as in purity, electrical non-conductivity, and low in linear expansibility.

Abstract: An automatic electroplating apparatus which comprises a power-driven larger rotary drum containing plating solution therein, a plurality of power-driven smaller rotary drums disposed within the larger drum and immersed in the plating solution, and a plurality of through holes formed in each of the smaller drums for permitting the plating solution to interflow between insides of the larger and the smaller drums, each of the smaller drums being arranged so as to rotate on its own axis and synchronously to revolve orbitally around a vertical axis of the larger drum.