Patents by Inventor Tetsuya Inaba

Tetsuya Inaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method of producing the same
    Publication number: 20010040793
    Abstract: An electronic device comprising plurality of chips mounted at a high density as in a multi-chip module and having a reduced area and a thinner shape, provided with a folded flexible board having flexibility, chips mounted on a surface of the flexible board, and an adhesive comprising an insulating material filled between facing surfaces of the folded board for sealing the chips and affixing the facing surfaces.
    Type: Application
    Filed: January 31, 2001
    Publication date: November 15, 2001
    Inventor: Tetsuya Inaba