Abstract: A memory device includes a semiconductor memory unit and a controller circuit configured to communicate with a host through a serial interface and access the semiconductor memory unit in response to commands received through the serial interface. The controller circuit, in response to a host command to read parameters of the memory device, updates at least one of parameters of the memory device stored in the memory device based on operational settings of the memory device, and transmits the updated parameters through the serial interface to the host.

Abstract: A memory system includes first through fifth pins connectable to a host device to output to the host device a first signal through the third pin and to receive from the host device a first chip select signal through the first pin, a second chip select signal through the second pin, a second signal through the fourth pin, and a clock signal through the fifth pin, an interface circuit configured to recognize, as a command, the second signal received through the fourth pin immediately after detecting the first or second chip select signal, and first and second memory cell arrays.

Abstract: A memory system includes a plurality of pins for connection to the outside of the memory system, one of the pins being configured to receive a command signal, a memory cell array including a plurality of first memory blocks and a second memory block in which status data indicating which of the first memory blocks is defective, is stored, and a control circuit configured to determine whether or not a first memory block targeted by the command signal is indicated as being defective in the status data. The control circuit allows an operation to be performed on the targeted first memory block in accordance with the command signal when the targeted first memory block is not indicated as being defective, and blocks the operation to be performed on the targeted first memory block when the targeted first memory block is indicated as being defective.

Abstract: A memory system includes a semiconductor memory device including a plurality of blocks, and a controller configured to register a block designated in a protection command as a protected block in a storage region. When the control circuit receives from a host a command to erase the protected block or write to the protected block, the control circuit does not issue a corresponding erase or write command to the semiconductor memory device and notifies the host of the failure to execute the command.

Abstract: A memory device includes a semiconductor memory unit, a controller circuit configured to communicate with a host through a serial interface, store write data to be written into a page of the semiconductor memory unit in a data buffer, and an error-correcting code (ECC) circuit configured to generate an error correction code from the write data if the ECC circuit is enabled. The controller circuit writes the error correction code with the write data into the page if the ECC circuit is enabled. A maximum column address of the page which is accessible from the host changes depending on whether or not the ECC circuit is enabled.

Abstract: A high-strength galvanized steel sheet includes a base steel sheet having a specific chemical composition and a zinc coating layer disposed on the surface of the base steel sheet in a coating weight per side of 20 g/m2 to 120 g/m2, wherein the amount of hydrogen measured by a specific method is 0.05 mass ppm to 0.40 mass ppm; and ISisur/ISibulk and IMnsur/IMnbulk calculated by a specific method are not more than 2.0 and not more than 3.0, respectively.

Abstract: A rotor (1) for a rotary electric machine includes a rotor core (2) including a first core portion (20) having a plurality of core pieces (5, 6) joined together through caulking portions (2a) and a hollow first lightening portion (20a), and a second core portion (21) having a plurality of core pieces (7, 8) joined together through caulking portions (2a) and a press-fit portion (21b). A radial magnetic path width of a ring-shaped outer circumferential portion formed by laminating the first core portion (20) and the second core portion (21) changes along a circumferential direction of the rotor core (2). Therefore, a weight and an inertia can be reduced.

Abstract: A coil is configured so that: N conductor wires of wave windings each divided at at least two positions in a circumferential direction are provided in one of a plurality of slots; within a unit of the divided wave windings in which conduction is made, the N conductor wires are connected in one of series and parallel to each other at division positions located at substantially the same circumferential position of conductor-wire end portions; division units of the divided wave windings are connected in series to each other, and a total number of series turns of the series-connected division units of the each phase is a predetermined number of series turns, which does not exceed an upper limit value of a terminal voltage of the rotary electric machine; and the series-connected division units of the each phase have the same total number of series turns.

Abstract: Provided is a rotary electric machine, including: a stator; and a rotor provided on the stator so as to be rotatable about a rotation shaft, in which the rotor includes, at an outer circumference thereof, magnetic poles arranged so as to have different polarities alternately, the magnetic poles being formed of a rotor core in which electromagnetic steel plates are stacked, the magnetic poles being excited by permanent magnets which are housed in gaps disposed at an outer circumferential part of the rotor core, and in which the rotor core includes, at an inner circumferential part thereof, in the same stack plane: a short circuit magnetic path connecting magnetic pole pieces which form the magnetic poles; and a protruding portion held in contact with the permanent magnets, which is positioned between magnetic pole pieces which are not connected to the short circuit magnetic path.

Abstract: Provided is a rotary electric machine, including: a stator; and a rotor provided on the stator so as to be rotatable about a rotation shaft, in which the rotor includes, at an outer circumference thereof, magnetic poles arranged so as to have different polarities alternately, the magnetic poles being formed of a rotor core in which electromagnetic steel plates are stacked, the magnetic poles being excited by permanent magnets which are housed in gaps disposed at an outer circumferential part of the rotor core, and in which the rotor core includes, at an inner circumferential part thereof, in the same stack plane: a short circuit magnetic path connecting magnetic pole pieces which form the magnetic poles; and a protruding portion held in contact with the permanent magnets, which is positioned between magnetic pole pieces which are not connected to the short circuit magnetic path.

Abstract: A coil is configured so that: N conductor wires of wave windings each divided at at least two positions in a circumferential direction are provided in one of a plurality of slots; within a unit of the divided wave windings in which conduction is made, the N conductor wires are connected in one of series and parallel to each other at division positions located at substantially the same circumferential position of conductor-wire end portions; division units of the divided wave windings are connected in series to each other, and a total number of series turns of the series-connected division units of the each phase is a predetermined number of series turns, which does not exceed an upper limit value of a terminal voltage of the rotary electric machine; and the series-connected division units of the each phase have the same total number of series turns.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slightly moving the capillary in an almost horizontal direction after the formation of the bump to reduce the strength of the base portion of the gold wire connected to the bump; and a wire cutting step of cutting the gold wire at the base portion after the sliding step. In the sliding step, a moving speed of the capillary is made smaller than that in the bump forming step.

Abstract: A flatness measuring apparatus is adapted to measure the flatness of the surface of a plate-shaped object such as a disk in a non-contact fashion. A disk is removably held by a measuring table, with the projection of the measuring table engagedly received in a central through hole of the disk. A plurality of eddy current undulation sensors are arranged in a sensor head that is arranged so as to be able to linearly move back and forth along the measuring table. Said eddy current undulation sensors generate an eddy current in said disk and detect any undulation on the surface of said disk. A flatness map is produced for the surface of the disk based on a signal representing the position of the sensor head and on signals from the eddy current undulation sensors, and then is output to a display and/or a printer.

Abstract: In a surface treatment apparatus for a rotating disc 10, the outer peripheries of the disc 10 are brought into contact with a pair of positioning rollers 13, 14 to position the disk 10 at the predetermined position. A first treatment roller 17 brought into contact with one of the surfaces of the disc 10 and a second treatment roller 18 brought into contact with the other surface of the disc 10 are arranged at both side of the disk 10, and the rollers 17, 18 are drive to move to come close to and away from each other. When the disk 10 is held between the rollers 17, 18, the frictional force of the rollers relative to the disc 10 is differentiated between an end and the opposite end of each of the rollers, thereby, the rotary motions of the rollers 17, 18 are transformed into a rotary motion of the disc 10 to treat the surfaces of the rotating disc.

Abstract: An apparatus for inspecting a surface of a disk comprises an indexing table having chucks for holding said disks respectively, said chucks being arranged angularly at regular intervals on the indexing table. Each of disks held by the respective chucks is moved by indexing revolution of the indexing table sequentially from a loading station where the disk is loaded onto the chuck, to an inspection station where the disk is inspected for a surface of the disk and then to an unloading station where the inspected disk is unloaded to the outside of the apparatus. The disk loaded onto a chuck at the loading station is driven to rotate until the disk gets to a predetermined rate of revolution before the disk arrives at the inspection station. The disk which has already get to the predetermined rate of revolution can be immediately inspected for the surface of the disk in the inspection station by an inspection device.

Abstract: A lumbar support garment for surrounding at least the lumbar region of a wearer of the garment comprises a main cloth, a stretchable auxiliary belt, and longitudinal sheet-form support bones. The main cloth comprises a single-sheet of cloth made of stretchable fabric, or a face cloth and a lining cloth made of stretchable knit fabric, and extends in use from the lumbar region of the wearer's back, around the wearer's sides, to at least the sides of the wearer's abdomen. The main cloth includes vertical seam parts in the vicinity of the side regions or seam parts at least extending from the waist sides which slant downwards in the front of the main cloth. Darts are formed at the seam parts configuring the vertical-sectional form in a convex shape to the skin side. The stretchable auxiliary belt is made of stretchable knit fabric narrower than the main cloth and extends from the back at least at both right regions and is fixed to the main cloth at least at both right and left ends of the auxiliary belt.

Abstract: A thin film magnetic head of the present invention comprises an insulating layer and a protective layer both of which are made of a magnetic material or a nonmagnetic material containing a magnetic material so as to inhibit the contour effect which is a trouble in making an attempt to increase the recording density.