Abstract: A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape on the second surface of the semiconductor substrate, removing the first protective tape, dicing the semiconductor substrate from the first surface side to separate the semiconductor substrate to a plurality of semiconductor chips, sticking a third protective tape on the first surface of a plurality of the semiconductor chips, removing the second protective tape, and etching a cutting surface of the semiconductor chip and the second surface of the semiconductor chip by dry etching.

Abstract: There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.

Abstract: A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

Abstract: There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.

Abstract: A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

Abstract: A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape on the second surface of the semiconductor substrate, removing the first protective tape, dicing the semiconductor substrate from the first surface side to separate the semiconductor substrate to a plurality of semiconductor chips, sticking a third protective tape on the first surface of a plurality of the semiconductor chips, removing the second protective tape, and etching a cutting surface of the semiconductor chip and the second surface of the semiconductor chip by dry etching.

Abstract: A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

Abstract: A luminous device includes one or more line-shaped luminous units each including an elongated light guide, one or more light sources, and a reflective layer. The light guide has a generally flat luminous surface for emitting light and another surface disposed away from the luminous surface. The light source serves to provide light into the light guide. The reflective layer is disposed on the above-mentioned another surface of the light guide. The light guide may have a ring shape. Since the luminous device produces a continuous line-shaped luminous image, e.g., a ring-shaped luminous image, it may be used for clearly indicating a heating range of an induction heating cooker.

Abstract: A pressure responsive switch includes a flexible hollow cord member which includes a predetermined wall portion and an opposing portion which generally opposes the predetermined wall portion. In a transverse cross section of the hollow cord member, a neutral axis of the cord switch is located to the predetermined wall portion side from the center of the distance between the predetermined wall portion and the opposing portion. A contact portion is disposed inwardly of the hollow cord member and extends on a portion of the predetermined wall portion along the longitudinal direction of the hollow cord member. A contact body is disposed apart from the contact portion and extends along the longitudinal direction of the hollow cord member, the contact body being disposed inwardly of the hollow cord member and extending from the opposing portion to portions between the predetermined wall portion and the opposing portion in the hollow cord member, as viewed from a transverse cross section of the hollow cord member.

Abstract: A cord switch that includes a hollow flexible cord member, contact lines and a bridge conductor. The cord member includes two portions generally opposed to and spaced apart from each other in the transverse direction of the cord member. The contact lines are disposed in parallel to each other on one of the inner portions of the two portions of the cord member. The bridge conductor is disposed on the other of the two inner portions so as to be generally opposed to apart from the contact lines. When the cord member is pressed, the bridge conductor is brought into contact with the contact lines to energize the cord member. The cord switch is configured so that its neutral axis is positioned on the side of the one of two inner portions with respect to the central portion of the distance between the two wall portions. As a result, even if the cord switch is mounted at a comer portion of a window frame of a vehicle, contact between the contact lines and bridge conductor can be prevented.