Abstract: Provided is a rare-earth anisotropic magnet powder capable of achieving high magnetic properties while reducing the usage of Nd and Pr. The present invention provides a rare-earth anisotropic magnet powder comprising magnetic particles that contain rare-earth elements, boron, and a transition metal element. The rare-earth elements include a first rare-earth element that comprises Ce and/or La and a second rare-earth element that comprises Nd and/or Pr. The rare-earth elements have a first ratio (R1/Rt) of 5% to 57%. The first ratio (R1/Rt) is a ratio of an amount (R1) of the first rare-earth element to a total amount (Rt) of the rare-earth elements in terms of the number of atoms. The first rare-earth element has a La ratio (La/R1) of 0% to 35%. The La ratio (La/R1) is a ratio of an amount of La to the amount (R1) of the first rare-earth element in terms of the number of atoms. The magnetic particles have a Ga content of 0.35 at % or less with respect to 100 at % as a whole.

Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: A gold sputtering target has a gold purity of 99.999% or more. In such a gold sputtering target, an average value of Vickers hardness is 20 or more and less than 40, an average crystal grain size is 15 ?m or more and 200 ?m or less, and a {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Abstract: A photosensitive resin composition according to an embodiment of the present disclosure contains: a binder polymer including a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group; a photopolymerizable compound; a photopolymerization initiator; a sensitizer having an absorption at 340 to 430 nm; and an ultraviolet absorber, in which a molar absorption coefficient of the ultraviolet absorber for light at a wavelength of 365 nm is in a range of 500 to 50000 L/(mol·cm).

Abstract: An aspect of the present disclosure relates to a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, in which the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group, and a weight molecular weight of the binder polymer is 7500 to 23000.

Abstract: A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: A gold sputtering target has a gold purity of 99.999% or more. In such a gold sputtering target, an average value of Vickers hardness is 20 or more and less than 40, an average crystal grain size is 15 ?m or more and 200 ?m or less, and a {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: A gold sputtering target has a gold purity of 99.999% or more. In such a gold sputtering target, an average value of Vickers hardness is 20 or more and less than 40, an average crystal grain size is 15 ?m or more and 200 ?m or less, and a {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Abstract: A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 ?m or more and 200 ?m or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Abstract: An electrode structure of a back electrode including metal layers laminated in the following order: a Ti layer, a Ni layer, and a Ag alloy layer. The Ag alloy layer includes an Ag alloy and an addition metal M selected from Sn, Sb, and Pd. The electrode structure is configured such that when subjected to elemental analysis with an X-ray photoelectron spectrometer in the depth direction from the Ag alloy layer to the Ni layer, on the boundary between the Ni layer and the Ag alloy layer, an intermediate region where spectra derived from all the metals, Ni, Ag, and the addition element M, can be detected is observable, and, when each metal content in the intermediate region is converted based on the spectra derived from all the metals Ni, Ag, and the addition element M, the maximum of the addition element M content is 5 at % or more.

Abstract: A locking structure includes: a locking protrusion and a locking arm. The locking arm includes a flexible arm main body and an engaging projection portion protruding from an outer surface of the arm main body. The locking protrusion includes a protrusion main body on which an arm guide surface, a protruding tip surface, and an engaging surface are disposed along the engagement direction, and a jig groove that is formed in the protrusion main body. The engaging projection portion is formed on the outer surface at a position away from an arm tip of the arm main body in the engagement direction. The protruding tip surface is longer than the arm tip in the engagement direction. The jig groove cuts out the protrusion main body in the engagement direction from the arm guide surface to the protruding tip surface.

Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

Abstract: An adhesive injection method is for injecting an adhesive that bonds an outer plate and a reinforcing member. The reinforcing member has through holes bored through the reinforcing member in a direction intersecting a bonding surface facing the outer plate. The method includes positioning the outer plate and the reinforcing member; disposing a sealing material covering a gap between the outer plate and the reinforcing member; and injecting the adhesive into the through holes in order from one end to the other end of the bonding surface. At the injecting, while the adhesive is injected into the through hole, when the adhesive is recognized through another through hole formed adjacent to the through hole into which the adhesive is being injected, a through hole into which the adhesive is to be injected is shifted from the through hole into which the adhesive is being injected to the other through hole.

Abstract: A composite material includes a web portion and a flange portion disposed at an end portion of the web portion. The flange portion is formed from fiber sheets laminated and has a surface on one side in a laminating direction of the flange portion serving as an inner surface to which the end portion of the web portion is connected and a surface on the other side in the laminating direction serving as an outer surface. The inner surface of the flange portion has a tapered surface having a thickness that is reduced from a base portion to which the end portion of the web portion is connected toward a front end portion in the laminating direction. The flange portion includes an outermost surface fiber sheet disposed on the tapered surface, the outermost surface fiber sheet serving as the fiber sheet on an outermost surface that covers the tapered surface.

Abstract: An electrical connection box includes a housing including a frame and a lower cover configured to be fitted to the frame in a fitting direction. At least part of the frame and at least part of the lower cover form a tubular lead-out portion. An axial direction of the lead-out portion extends along the fitting direction, and the lead-out portion allows a wire harness to be pulled out through the lead out portion, the wire harness including an end portion that is to be disposed in an inside of the housing. The lead-out portion includes harness contact portions formed on an inner peripheral surface of the lead-out portion and configured to contact the wire harness. The harness contact portions extend along the fitting direction and are spaced from one another in a circumferential direction of the lead-out portion.

Abstract: A gold sputtering target has a gold purity of 99.999% or more. In such a gold sputtering target, an average value of Vickers hardness is 20 or more and less than 40, an average crystal grain size is 15 ?m or more and 200 ?m or less, and a {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Abstract: A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 ?m or more and 200 82 m or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.