Patents by Inventor Tetsuya KATSURAGAWA

Tetsuya KATSURAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11004699
    Abstract: An electronic device comprises: an electronic component; a resin molded body in which the electronic component is embedded and fixed; and a bendable bend portion continuous with the resin molded body. For example, the bend portion is molded integrally with the resin molded body. Thus, electronic device can be reduced in size and thickness.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: May 11, 2021
    Assignee: OMRON Corporation
    Inventors: Wakahiro Kawai, Tetsuya Katsuragawa
  • Publication number: 20200035511
    Abstract: An electronic device comprises: an electronic component; a resin molded body in which the electronic component is embedded and fixed; and a bendable bend portion continuous with the resin molded body. For example, the bend portion is molded integrally with the resin molded body. Thus, electronic device can be reduced in size and thickness.
    Type: Application
    Filed: September 19, 2017
    Publication date: January 30, 2020
    Applicant: OMRON Corporation
    Inventors: Wakahiro KAWAI, Tetsuya KATSURAGAWA