Abstract: Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C.

Abstract: Provided is an encapsulating resin composition for a power device including an epoxy resin, an inorganic filler, a curing agent, and a curing accelerator. This composition is molded under a condition of 175° C. for 2 minutes and then subjected to after-curing under a condition of 175° C. for 4 hours to obtain a test piece having a diameter of 100 mm and a thickness of 2 mm, and a half width of a current-time curve obtained by measuring the test piece with a thermally stimulated depolarization current method according to an order of (i) to (v) below is equal to or less than 800 seconds, (i) increase a temperature of the test piece to 150° C. at a rate of 5° C./min without applying a voltage, (ii) applying a constant voltage of 500 V for 30 minutes while maintaining the temperature of the test piece at 150° C., (iii) lower the temperature of the test piece to 45° C. at a rate of 5° C.

Abstract: A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150° C. of the epoxy resin is equal to or less than 3 poises.

Abstract: A rotor-fixing resin composition of the present invention comprising: an epoxy resin-containing thermosetting resin; a curing agent; and an inorganic filler, wherein a tensile elongation at break-a is 0.1% or higher and 1.7% or lower, the tensile elongation at break-a is obtained by subjecting a test piece to a tensile test pursuant to JIS K7162 under conditions of a temperature of 120° C., a test force of 20 MPa and 100 hours, and the test piece is a cured product produced by subjecting the rotor-fixing resin composition to curing by heating at 175° C. for 4 hours, and molding to a dumbbell shape pursuant to JIS K7162.

Abstract: A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150° C. of the epoxy resin is equal to or less than 3 poises.