Patents by Inventor Tetsuya Kitaichi

Tetsuya Kitaichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sealed module
    Patent number: 9583409
    Abstract: A resin-sealed module is provided which reduces the warpage of a substrate and the detachment between a sealing resin and the substrate which occur during re-reflow, has the excellent flatness of the top and bottom surfaces, and reduces the occurrence of the short failures. A resin layer made of a thermoplastic resin is arranged on top of a substrate, and a resin layer made of a thermosetting resin is arranged on top of this resin layer, thereby reducing the warpage of the substrate and the detachment between the sealing resin and the substrate which occur during re-reflow.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: February 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuo Yokoyama, Tetsuya Kitaichi
  • RESIN SEALED MODULE
    Publication number: 20130300002
    Abstract: A resin-sealed module is provided which reduces the warpage of a substrate and the detachment between a sealing resin and the substrate which occur during re-reflow, has the excellent flatness of the top and bottom surfaces, and reduces the occurrence of the short failures. A resin layer made of a thermoplastic resin is arranged on top of a substrate, and a resin layer made of a thermosetting resin is arranged on top of this resin layer, thereby reducing the warpage of the substrate and the detachment between the sealing resin and the substrate which occur during re-reflow.
    Type: Application
    Filed: July 12, 2013
    Publication date: November 14, 2013
    Inventors: Yasuo Yokoyama, Tetsuya Kitaichi