Abstract: A substrate transporting device used in the process of manufacturing, for instance, semiconductor chips including a substrate guide comprised of a substrate guide rail which guides one side of each substrate and a substrate supporting plate which supports another side of the substrate, feeding claws for feeding a substrate to, for instance, a bonding position, the feeding claws being provided on a feeding claw holder and extending in the direction perpendicular to the substrate supporting plate, a claw X-direction feeder which moves the feeding claw holder in a direction in which the substrate is conveyed along the substrate guide, and a claw Y-direction feeder which moves the feeding claw holder in a direction perpendicular to the direction in which the substrate is conveyed along the substrate guide; thus, the substrates are conveyed one pitch at a time by means of a rectangular motion of the feeding claws on a horizontal plane effected by the claw X-direction feeder and the claw Y-direction feeder.

Abstract: An apparatus for conveying a wafer to wafer work suction-holding stage and then discharging a worked wafer from the wafer work suction-holding stage, including a loader side elevator device, a wafer position correcting stage, a wafer work suction-holding stage, a wafer carrying table and an unloader side elevator device which are successively disposed in this order; and the apparatus further including a conveyor which conveys a wafer inside a loader side magazine carried on the loader side elevator device to a point above the positional correction suction-holding stage, a stopper which positions the wafer conveyed by the conveyor to the wafer position correcting stage, and a feeding pawl moving device which operates after the wafer position correcting stage and wafer work suction-holding stage have been moved vertically so that the upper surface of the wafer position correcting stage is at substantially the same height as the upper surface of the stopper and so that the upper surface of the wafer work suction

Abstract: A baking oven for heating lead frames used in the manufacturing of semiconductor devices including an oven main body having an entrance and an exit for lead frames, a heating device which creates a high-temperature atmosphere inside the oven main body, a lead frame magazine installed inside the oven main body so as to accommodate lead frames in a stacked fashion, a magazine mover which moves the lead frame magazine in a vertical direction, and a width adjustment device that changes the width of the lead frame magazine in a horizontal direction. The magazine mover and the width adjustment device are provided outside the oven main body for securing a high lead frame accommodation capacity and a longer heating time of the oven.

Abstract: A tape bonding apparatus for bonding leads of a film carrier to bumps of a pellet including a linear cam that moves up and down a bonding stage which carries the pellet. A vertical movement adjustment assembly made up with an eccentric shaft, an adjustment lever and an adjusting screw adjusts the relative amount of vertical movement of the bonding stage with respect to the linear cam. A gap sensor detects the amount of the vertical movement of the bonding stage and shows the distance between the leads and the bumps in a numeric value. Thus, the distance or clearance between the leads and the bumps can be adjusted easily.